3.
Loosen
until
all
load
is
removed
and
the
spring
plate
is
free
to
rotate.
4.
Rotate
the
spring
plate
counter-clockwise
to
align
the
four
large
keyhole
openings
with
the
posts
present
on
the
module.
Figure
2.
Rotating
the
spring
plate
on
the
module
5.
Carefully
remove
the
cover
from
the
module
to
expose
the
LGA
interposer.
Be
careful
to
keep
the
cover
level
and
do
not
tilt
or
twist
during
the
removal.
Figure
3.
Removing
the
cover
to
expose
the
interpose
.
120
Hardware
(Remove
and
Replace;
Part
Locations
and
Listings)
Summary of Contents for 270
Page 2: ......
Page 12: ...x Hardware Remove and Replace Part Locations and Listings...
Page 279: ...Figure 3 CCIN 2881 with pluggable DIMM Analyze hardware problems 267...
Page 281: ...Figure 6 Models 830 SB2 with FC 9074 HSL and SPCN locations Analyze hardware problems 269...
Page 283: ...Figure 1b Model 840 SB3 processor tower dual line cord Analyze hardware problems 271...
Page 294: ...01 gif port and LED locations 282 Hardware Remove and Replace Part Locations and Listings...
Page 295: ...s src rzaq4519 gif locations Analyze hardware problems 283...
Page 483: ...Table 1 Cover assembly FC 5095 Expansion I O Tower Analyze hardware problems 471...
Page 614: ...602 Hardware Remove and Replace Part Locations and Listings...
Page 618: ...606 Hardware Remove and Replace Part Locations and Listings...
Page 621: ......
Page 622: ...Printed in USA SY44 5917 02...