Use
this
procedure
to
remove
or
replace
the
air
moving
device
(AMD)
-
B01;
B02
(concurrently)
on
a
Model
825.
Two
AMDs
(excluding
the
AMDs
mounted
on
the
power
supplies),
and
two
power
supplies
must
be
installed
to
perform
this
procedure.
Attention
:
The
replacement
fan
must
be
reconnected
within
30
seconds
of
removal
of
the
failed
unit,
or
system
failure
or
shutdown
may
result.
To
remove
or
replace
the
AMDs:
1.
Remove
the
front
cover,
see
2.
Perform
the
following:
v
To
remove
the
bottom
AMD.
a.
Pull
on
the
top
knob
to
release
the
AMD.
b.
Pull
the
AMD
out.
v
To
remove
the
top
AMD.
a.
Remove
the
plate
that
holds
in
the
AMD
(located
on
the
top
right
corner).
b.
Pull
on
the
top
knob
to
release
the
AMD.
c.
Pull
out
the
AMD.
3.
Reverse
this
procedure
to
install
the
AMDs.
This
ends
the
procedure.
Model
825
-
Cards
(concurrent)
For
use
by
authorized
service
providers.
Use
this
procedure
to
remove
or
replace
cards
(concurrently)
in
the
Model
825.
Concurrent/dedicated
guidelines
for
Model
825:
In
some
cases
you
do
not
need
to
power
down
the
system
to
change
PCI
cards.
Use
the
following
guidelines
to
determine
if
you
should
use
dedicated
or
concurrent
remove
and
replace
procedures.
If
you
use
concurrent
maintenance
on
a
partitioned
system,
follow
the
procedures
from
the
partition
that
owns
the
resource.
If
the
resource
is
not
owned,
follow
the
procedure
from
the
primary
partition.
For
all
Model
825
cards:
v
Card
positions
C01
through
C07
and
C10
through
C12
permit
concurrent
maintenance
using
HSM.
You
can
power
down
the
individual
card
slot.
v
If
the
resource
is
the
load
source
IOA
or
the
load
source
IOP,
or
any
other
storage
IOA/IOP
with
critical
DASD
attached
for
the
system,
primary,
or
secondary
partition,
follow
the
on-screen
instructions
when
you
use
HSM
to
power
down
the
IOP
or
IOA.
Instructions
to
use
functions
68
and
69
on
the
control
panel
will
be
included.
v
If
the
resource
is
the
console
IOA
or
the
console
IOP
for
the
system
or
primary
partition,
you
cannot
power
down
the
domain.
v
If
the
resource
is
the
console
IOA
or
the
console
IOP
for
a
secondary
partition,
then
power
down
the
secondary
partition
and
follow
the
procedure
from
the
primary
partition.
v
All
other
card
positions
require
dedicated
maintenance.
See
CAUTION:
The
circuit
card
contains
lead
solder.
To
avoid
the
release
of
lead
(Pb)
into
the
environment,
do
not
burn.
Discard
the
circuit
card
as
instructed
by
local
regulations.
(RSFTC234)
30
Hardware
(Remove
and
Replace;
Part
Locations
and
Listings)
Summary of Contents for 270
Page 2: ......
Page 12: ...x Hardware Remove and Replace Part Locations and Listings...
Page 279: ...Figure 3 CCIN 2881 with pluggable DIMM Analyze hardware problems 267...
Page 281: ...Figure 6 Models 830 SB2 with FC 9074 HSL and SPCN locations Analyze hardware problems 269...
Page 283: ...Figure 1b Model 840 SB3 processor tower dual line cord Analyze hardware problems 271...
Page 294: ...01 gif port and LED locations 282 Hardware Remove and Replace Part Locations and Listings...
Page 295: ...s src rzaq4519 gif locations Analyze hardware problems 283...
Page 483: ...Table 1 Cover assembly FC 5095 Expansion I O Tower Analyze hardware problems 471...
Page 614: ...602 Hardware Remove and Replace Part Locations and Listings...
Page 618: ...606 Hardware Remove and Replace Part Locations and Listings...
Page 621: ......
Page 622: ...Printed in USA SY44 5917 02...
