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IBM BladeCenter PS703 and PS704 Technical Overview and Introduction
Report blade power consumption to the AMM through the service processor.
Report blade system voltage levels to the AMM through the service processor.
Accommodate BladeCenter/AMM defined thermal triggers such as warning temperature,
throttle temperature, and critical temperature.
2.13.2 EnergyScale device
The EnergyScale device dynamically optimizes the processor performance depending on
processor power and system workload.
The IBM POWER7 chip is a significant improvement in power and performance over the IBM
POWER6 chip. POWER7 has more internal hardware, and power and thermal management
functions to interact with:
More hardware: Eight cores versus two cores, four threads versus two threads per core,
and asynchronous processor core chipset
Advanced Idle Power Management functions
Advanced Dynamic Power Management (DPM) functions in all units in hardware
(processor cores, processor core chiplet, chip-level nest unit level, and chip level)
Advanced Actuators/Control
Advanced Accelerators
The new EnergyScale device has a more powerful microcontroller, more A/D channels and
more busses to handle the increase workload, link traffic, and new power and thermal
functions.
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