http://ralfss21.raleigh.ibm.com:8099/help/topic/com.ibm.acc.8721.doc/
product_page.html for additional information.
v
A socket cover and heat-sink filler or a microprocessor and heat sink must
always be installed on microprocessor sockets 1, 3, and 4. Microprocessor socket
2 will only have a socket cover when a microprocessor is not install. If the
compute node has only one microprocessor, it must be installed in
microprocessor socket 1.
v
The air baffles are installed over the DIMM connectors.
v
The ventilation holes on the compute node are not blocked.
v
The compute node CMOS battery is operational. If the CMOS battery becomes
defective, replace it immediately.
Handling static-sensitive devices
To reduce the possibility of damage from electrostatic discharge, observe these
precautions.
Attention:
Static electricity can damage the compute node and other electronic
devices. To avoid damage, keep static-sensitive devices in their static-protective
packages until you are ready to install them.
v
When you work on a IBM Flex System chassis that has an electrostatic discharge
(ESD) connector, use a wrist strap, especially when you handle modules,
optional devices, or compute nodes. To work correctly, the wrist strap must have
a good contact at both ends (touching your skin at one end and firmly
connected to the ESD connector on the front or back of the IBM Flex System
chassis).
v
Limit your movement. Movement can cause static electricity to build up around
you.
v
Handle the device carefully, holding it by its edges or its frame.
v
Do not touch solder joints, pins, or exposed circuitry.
v
Do not leave the device where others can handle and damage it.
v
While the device is still in its static-protective package, touch it to an
unpainted
metal part of the IBM Flex System chassis or any
unpainted
metal surface on any
other grounded rack component in the rack in which you are installing the
device for at least 2 seconds. This drains static electricity from the package and
from your body.
v
Remove the device from its package and install it directly into the compute node
without setting down the device. If it is necessary to set down the device, put it
back into its static-protective package. Do not place the device on the compute
node cover or on a metal surface.
v
Take additional care when you handle devices during cold weather. Heating
reduces indoor humidity and increases static electricity.
Returning a device or component
If you are instructed to return a device or component, follow all packaging
instructions, and use any packaging materials for shipping that are supplied to
you.
Updating the compute node configuration
Use this information to update the compute node configuration.
488
IBM Flex System x440 Compute Node Types 7917 and 2584: Installation and Service Guide
Summary of Contents for Flex System x440 Compute Node
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