Chapter
4.
Installation
and
Removal
Procedures
This
chapter
describes
how
to
install
and
remove
processor
subsystems,
I/O
subsystems,
integrated
battery
feature
(IBF),
and
PCI
adapters.
If
individual
subsystems
were
shipped
separately
to
a
customer’s
site
to
reduce
weight,
use
the
procedures
contained
in
this
chapter
to
assemble
the
system
rack
with
the
subsystems.
The
procedures
in
this
chapter
can
also
be
used
to
remove
subsystems
in
order
to
reduce
the
weight
of
the
system
so
that
it
can
be
moved
to
the
installation
location
at
the
customer’s
site.
Processor
Subsystem
Attention:
Installing
a
processor
subsystem
requires
the
use
of
a
lift
tool.
This
procedure
requires:
v
The
use
of
a
lift
tool
(part
number
09P2481)
and
lift-plate
assembly
tool
(part
number
11P4369).
v
The
lift
tool
wheels
must
be
chocked
to
prevent
it
from
moving
during
the
operation.
The
rack
must
not
be
on
its
casters.
The
leveling
pads
must
be
engaged
to
prevent
the
rack
from
moving
during
the
operation.
Note:
In
the
process
of
removing
and
installing
processor
subsystems
for
weight
reduction,
the
outer
chassis
(frame
cage)
is
always
left
in
place
in
the
rack.
This
section
describes
how
to
install
and
remove
a
processor
subsystem.
Powering
the
System
On
The
Hardware
Management
Console
is
used
to
turn
the
power
on
to
the
processor
subsystems
through
the
HMC
user
interface.
For
a
detailed
procedure,
see
″
Basic
System
Management
Tasks
″
,
located
in
the
IBM
Hardware
Management
Console
for
pSeries
Installation
and
Operations
Guide
.
Processor
subsystems
can
be
powered
on
after
all
of
the
following
steps
have
been
completed:
v
All
I/O
drawer
cables
are
connected
v
Base
system
cables
are
connected
(cables
for
rack
power,
bulk
power
subsystem,
integrated
battery
feature)
v
All
PCI
cables
to
supported
subsystems
are
connected
v
The
hardware
management
console
(HMC)
is
connected
v
Source
power
is
connected
and
turned
on
to
the
system
Note:
The
UEPO
switch
must
be
switched
to
on
to
restore
power
to
the
entire
rack
after
performing
certain
service
operations.
Removing
power
from
an
individual
processor
subsystem
with
the
HMC
does
not
remove
power
from
other
processor
subsystems
or
from
the
bulk
power
assembly
in
the
system
rack.
After
the
required
cables
are
installed,
and
the
power
cables
are
connected,
examine
the
Power-In
LED
of
the
processor
subsystem
DCA,
and
the
Power-In
LEDs
of
both
DCAs
of
any
attached
I/O
subsystem(s).
If
any
of
the
Power-In
LEDs
of
the
DCAs
are
off,
for
the
system
that
you
are
trying
to
power
on,
push
the
white
Service
Complete
button
on
the
UEPO
panel.
The
action
should
restore
power
to
the
input
of
all
DCAs,
and
all
Power-In
LEDs
should
turn
on.
The
HMC
interface
provides
a
power-on
function
to
turn
on
the
power
to
the
system.
Progress
indicators,
also
referred
to
as
checkpoints
,
are
visible
on
the
operator
panel
display
on
the
HMC
as
the
system
power
is
turned
on.
The
base
system
and
I/O
subsystems
are
powered
on
through
the
system
power
control
network
(SPCN).
When
power
is
applied,
the
Power-Out
LED
of
the
processor
subsystem
DCA
and
the
Power-Out
LEDs
of
both
DCAs
of
any
attached
I/O
subsystem(s)
turn
on
and
stay
on.
This
action
indicates
that
power
levels
are
satisfactory
in
the
subsystems.
39
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