2
Contents
1. General
Information ................................................................................................................ 4
1.1. Features
................................................................................................................
4
1.2. System
Specifications
...........................................................................................
5
1.3. Dimensions
...........................................................................................................
7
1.4. Module
Descriptions
..............................................................................................
8
2. Installation
............................................................................................................................ 10
3. Operation
.............................................................................................................................. 12
3.1.
EZ code overview ................................................................................................ 12
3.2.
Dispensing Coins To Low Level........................................................................... 14
3.3.
Operating Function Descriptions ......................................................................... 15
3.4.
Setting Function Descriptions .............................................................................. 18
3.5.
Executive Setting Function Descriptions ............................................................. 39
3.6.
DIP Switch Setting............................................................................................... 47
4. Harness
Application
.............................................................................................................. 48
4.1.
List of Main Wire Harness
:
............................................................................... 48
4.2.
List of Wire Harness for ICT Bill Acceptor
:
....................................................... 48
4.3.
Wire Harness Pin Assignment for JPSTD interface ............................................. 49
4.4.
Wire Harness Pin Assignment for MDB interface ................................................ 53
4.5.
Wire Harness Pin Assignment for Executive & MDB Interface ............................ 57
4.6.
Wire Harness Pin Assignment for Download Box ................................................ 59
5. I/O
Circuit.............................................................................................................................. 60
6. Maintenance
......................................................................................................................... 63
7. Troubleshooting
.................................................................................................................... 65
7.1.
Error Code Messages ......................................................................................... 65
7.2. Error
Handling
.....................................................................................................
66
8. Firmware Download and Upgrade Instruction ....................................................................... 80
8.1.
MCU STM32 Firmware Download by FP-004 ..................................................... 80
8.2.
MCU STM32 Firmware Download by IrDA Special Function ........................... 83
9. PC Tool Instruction................................................................................................................ 84
9.1. Cashfloat
Setting
.................................................................................................
84
9.2. Serial
Number Setting ......................................................................................... 89
10. Read
Audit
Data
........................................................................................................... 90
10.1.
Read Audit Data by ICT MTB .............................................................................. 90
10.2.
Read Audit Data by IrDA ..................................................................................... 91
11. Module
Assembling Procedure .................................................................................... 92
11.1.
Upper Module Disassembling: ............................................................................ 92
11.2. Recognition
Module
Disassembling: ................................................................... 93
11.3.
Coin Discharge Module Disassembling: .............................................................. 94
12. Module
Exploded Views ............................................................................................... 95
Summary of Contents for cc6000
Page 1: ...1...
Page 7: ...7 1 3 Dimensions Unit mm Mounting position Vertical max deviation 3 Mark of conformity CE FCC...
Page 9: ...9 Coin Tubes Press the latch as shown below to remove the coin cassette...
Page 49: ...49 4 3 Wire Harness Pin Assignment for JPSTD interface Main wire harness...
Page 50: ...50...
Page 51: ...51 JPSTD wire harness for ICT Bill Acceptor...
Page 52: ...52...
Page 53: ...53 4 4 Wire Harness Pin Assignment for MDB interface Main wire harness...
Page 54: ...54...
Page 55: ...55 MDB wire harness for ICT Bill Acceptor...
Page 56: ...56...
Page 59: ...59 4 6 Wire Harness Pin Assignment for Download Box...
Page 60: ...60 5 I O Circuit JPSTD Interface...
Page 61: ...61 MDB Interface...
Page 62: ...62 Executive Interface...
Page 64: ...64...