11. Signals and Pinout
227
PowerSpan II User Manual
80A1010_MA001_09
Integrated Device Technology
www.idt.com
11.3.3
Single PCI PowerSpan II 484 HSBGA
illustrates the top, side, and bottom views of the PowerSpan II package.
E18. VSS
W2. PB_TEST2
AF8. PB_ABB_
E19. VDD33
W3. PB_D[45]
AF9. I2C_SDA
E20. VDD33
W4. PB_D[60]
AF10. PB_D[26]
E21. VDD33
W5. VDD33
AF11. VSS_IO
E22. P1_DVSS
W22. VDD33
AF12. PB_D[49]
E23. P1_AD[62]
W23. P1_AD[30]
AF13. PO_RST_
E24. P1_AD[38]
W24. P1_AD[29]
AF14. PB_D[25]
E25. P1_AD[55]
W25. P1_AD[28]
AF15. PB_RST_
E26. PCI_REQ[6]_
W26. PCI_REQ[7]_
AF16. VSS_IO
F1. VSS_IO
Y1. PB_D[52]
AF17. PB_D[16]
F2. PB_BR2_
Y2. PB_D[20]
AF18. INT[0]_
F3. NC
Y3. PB_TEST1
AF19. VSS_IO
F4. PB_A[6]
Y4. PB_D[13]
AF20. PB_D[4]
F5. VDD33
Y5. VDD33
AF21. VSS_IO
F22. VDD33
Y22. VDD33
AF22. NC
F23. P1_ACK64_
Y23. VSS
AF23. NC
F24. P1_AD[0]
Y24. P1_DEVSEL_
AF24. NC
F25. P1_REQ64_
Y25. P1_TRDY_
AF25. VSS_IO
F26. VSS_IO
Y26. VSS_IO
AF26. VSS_IO
Table 63: Package Characteristics
Feature
Description
Package Type
484 HSBGA
Package Body Size
23mm
JEDEC Specification
JEDEC MS-034 Variation AAJ-1