381
PowerSpan II User Manual
80A1010_MA001_09
Integrated Device Technology
www.idt.com
13.
Electrical and Signal Characteristics
This chapter describes the electrical characteristics of the PowerSpan II device. It also details the
pin-outs of both the Single PCI PowerSpan II and Dual PCI PowerSpan II. The following topics are
discussed:
•
“Electrical Characteristics” on page 381
•
“Power Dissipation” on page 383
•
“Operating Conditions” on page 384
13.1
Electrical Characteristics
PowerSpan II’s electrical characteristics are defined by PCI electrical characteristics and non-PCI
electrical characteristics.
13.1.1
PCI Electrical Characteristics
PowerSpan II's PCI interfaces are electrically compatible with the 3.3V and the 5.0V signaling
interfaces as defined by the
PCI 2.2 Specification
.
PowerSpan II supports the
CompactPCI Hot Swap Specification Revision 2.0
and is classified as Hot
Swap Silicon. PowerSpan II is compliant with the
PCI Local Bus Specification Revision 2.2
regarding
device accessibility after release of LOCAL_PCI_RST_ through Initially Retrying. Optionally devices
can choose to Initially Not Respond after release.
13.1.2
Non-PCI Electrical Characteristics
The following table,
, specifies the required DC characteristics of all non-PCI PowerSpan II
signal pins.
Table 86: HBGA Electrical Characteristics (non-PCI)
a
Symbol
Parameter
Condition
Min
Max
Units
V
IL
Input low voltage
V
OUT
V
OH
(min) or
V
OUT
V
OL
(max)
- 0.3
0.8
V
V
IH
Input high voltage
(5 V tolerant
LVTTL)
2.0
V
DD
+ 0.3
V
Iin
Input leakage
Current
V
IN
= 0 V or V
IN
= V
DD
5
µA
Iin
Input leakage
Current
(internal pull-up)
V
IN
= 0 V or V
IN
= V
DD
-2.0
-100
µA