14. Package Information
392
PowerSpan II User Manual
80A1010_MA001_09
Integrated Device Technology
www.idt.com
14.2.1
Single PCI 420 HSBGA Package
The thermal characteristics for the 420 package are based on the parameters in
.
shows the thermal characterization parameters from junction-to-top center (
JT
) and the
thermal resistance from junction to case for the 420 package. These values are based on the parameters
described in
.
Table 93: Thermal Parameters
Package Conditions
Package type
HSBGA 420
Package size
35 x 35 x 2.33 mm
3
Pitch
1.27 mm
Pad size
318 x 318 mil
2
Chip size
232 x 232 mil
2
Substrate (layers)
4 Layer
Substrate thickness
0.56 mm
PCB Conditions (JEDEC JESD51-7)
PCB Layers
4 Layer
PCB dimensions
101.6 x 114.3 mm
PCB thickness
1.6 mm
Simulation conditions
Power dissipation
3.0 watts
Ambient temperature
55
C
Table 94: 420 HSBGA Package Performance
Theta ja (C/W)
Psi
jt
(C/W)
Theta jc (C/W)
0 m/s
1 m/s
2 m/s
16.5
14.6
13.2
5.48
6.80