14. Package Information
393
PowerSpan II User Manual
80A1010_MA001_09
Integrated Device Technology
www.idt.com
14.2.2
Dual PCI 480 HSBGA Package
The thermal characteristics for the 480 package are based on the parameters in
.
shows the thermal characterization parameters from junction-to-top center (
JT
) and the
thermal resistance from junction to case for the 480 package. These values are based on the parameters
described in
.
Table 95: Thermal Parameters
Package Conditions
Package type
HSBGA 480L
Package size
37.5 x 37.5 x 2.33 mm
3
Pitch
1.27 mm
Pad size
303 x 303 mil
2
Chip size
253 x 253 mil
2
Substrate (layers)
4 Layer
Substrate thickness
0.56 mm
PCB Conditions (JEDEC JESD51-7)
PCB Layers
4 Layer
PCB dimensions
101.6 x 114.3 mm
PCB thickness
1.6 mm
Simulation Conditions
Power dissipation
3.0 watts
Ambient temperature
85
C
Table 96: 480 PBGA Package Performance
Theta ja (C/W)
Psi
jt
(C/W)
Theta jc (C/W)
0 m/s
1 m/s
2 m/s
15.1
13.2
11.8
4.87
6.00