387
PowerSpan II User Manual
80A1010_MA001_09
Integrated Device Technology
www.idt.com
14. Package
Information
This appendix discusses PowerSpan II’s packaging (mechanical) features. The following topics are
discussed:
•
“Package Characteristics” on page 387
•
“Thermal Characteristics” on page 391
14.1
Package Characteristics
PowerSpan II’s package characteristics are summarized in the following sections.
14.1.1
Single PCI PowerSpan II 420 HSBGA
illustrates the top, side, and bottom views of the PowerSpan II package.
Table 91: Package Characteristics
Feature
Description
Package Type
420 HSBGA
Package Body Size
35mm
JEDEC Specification
JEDEC MO-151 Variation BAT-1