Trademarks of Infineon Technologies AG
AURIX™, C166™, CanPAK™, CIPOS™, CIPURSE™, CoolGaN™, CoolMOS™, CoolSET™, CoolSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBLADE™,
EasyPIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, ISOFACE™, IsoPACK™, i-
Wafer™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OmniTune™, OPTIGA™, OptiMOS™, ORIGA™, POWERCODE™, PRIMARION™, PrimePACK™,
PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC™, SIEGET™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, SPOC™, TEMPFET™,
thinQ!™, TRENCHSTOP™, TriCore™.
Other Trademarks
Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited,
UK. ANSI™ of American National Standards Institute. AUTOSAR™ of AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT
Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVCo, LLC (Visa Holdings Inc.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft
Corporation. HYPERTERMINAL™ of Hilgraeve Incorporated. MCS™ of Intel Corp. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data
Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated
Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of
MURATA MANUFACTURING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Openwave™ of
Openwave Systems Inc. RED HAT™ of Red Hat, Inc. RFMD™ of RF Micro Devices, Inc. SIRIUS™ of Sirius Satellite Radio Inc. SOLARIS™ of Sun Microsystems, Inc.
SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. TEKTRONIX™ of
Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc.
VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited.
Trademarks Update 2014-07-17
Edition 2015-02-11
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2014 Infineon Technologies AG.
All Rights Reserved.
Do you have a question about any
aspect of this document?
Email:
Document reference
ANEVAL_201412_PL21_006
Legal Disclaimer
THE INFORMATION GIVEN IN THIS APPLICATION NOTE
(INCLUDING BUT NOT LIMITED TO CONTENTS OF
REFERENCED WEBSITES) IS GIVEN AS A HINT FOR THE
IMPLEMENTATION OF THE INFINEON TECHNOLOGIES
COMPONENT ONLY AND SHALL NOT BE REGARDED AS
ANY DESCRIPTION OR WARRANTY OF A CERTAIN
FUNCTIONALITY, CONDITION OR QUALITY OF THE
INFINEON TECHNOLOGIES COMPONENT. THE
RECIPIENT OF THIS APPLICATION NOTE MUST VERIFY
ANY FUNCTION DESCRIBED HEREIN IN THE REAL
APPLICATION. INFINEON TECHNOLOGIES HEREBY
DISCLAIMS ANY AND ALL WARRANTIES AND
LIABILITIES OF ANY KIND (INCLUDING WITHOUT
LIMITATION WARRANTIES OF NON-INFRINGEMENT OF
INTELLECTUAL PROPERTY RIGHTS OF ANY THIRD
PARTY) WITH RESPECT TO ANY AND ALL INFORMATION
GIVEN IN THIS APPLICATION NOTE.
Information
For further information on technology, delivery terms
and conditions and prices, please contact the nearest
Infineon Technologies Office (
).
Warnings
Due to technical requirements, components may
contain dangerous substances. For information on the
types in question, please contact the nearest Infineon
Technologies Office. Infineon Technologies
components may be used in life-support devices or
systems only with the express written approval of
Infineon Technologies, if a failure of such components
can reasonably be expected to cause the failure of that
life-support device or system or to affect the safety or
effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the
human body or to support and/or maintain and
sustain and/or protect human life. If they fail, it is
reasonable to assume that the health of the user or
other persons may be endangered.