Data Sheet
11
Rev. 1.00
2017-07-31
TLE9262BQXV33
Pin Configuration
Note:
all VS Pins must be connected to battery potential or insert a reverse polarity diodes where required;
all GND pins as well as the Cooling Tab must be connected to one common GND potential;
note that the tie bars at each package corner are connected to the cooling tab (see also
Chapter 18
)
30
CSN
SPI Chip Select Not Input
31
INT
Interrupt Output
; used as wake-up flag for microcontroller in SBC Stop or
Normal Mode and for indicating failures. Active low.
During start-up used to set the SBC configuration. External pull-up sets config
1/3, no external pull-up sets config 2/4.
32
RO
Reset Output
33
TXDLIN1
Transmit LIN1
34
RXDLIN1
Receive LIN1
35
TXDCAN
Transmit CAN
36
RXDCAN
Receive CAN
37
VCAN
Supply Input; for internal HS-CAN cell
38
GND
GND
39
CANL
CAN Low Bus Pin
40
CANH
CAN High Bus Pin
41
n.c.
not connected;
internally not bonded.
42
LIN1
LIN1 Bus;
Bus line for the LIN interface, according to ISO. 9141 and LIN
specification 2.2 as well as SAE J2602-2.
43
GND
Ground
44
N.U.
Not Used;
Used for internal testing purpose. Do not connect, leave open
45
n.c.
not connected;
internally not bonded.
46
n.c.
not connected;
internally not bonded.
47
FO2
Fail Output 2
- Side Indicator; Side indicators 1.25Hz 50% duty cycle output;
Open drain. Active LOW.
Alternative Function: GPIO1
; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO2, see also
Chapter 14.1.1
)
48
FO3/TEST
Fail Output 3
- Pulsed Light Output; Break/rear light 100Hz 20% duty cycle
output;
Open drain. Active LOW
TEST
; Connect to GND to activate SBC Development Mode;
Integrated pull-up resistor. Connect to VS with pull-up resistor or leave open for
normal operation.
Alternative Function: GPIO2
; configurable pin as WK, or LS, or HS supplied by
VSHS (default is FO3, see also
Chapter 14.1.1
)
Coolin
g Tab
GND
Cooling Tab - Exposed Die Pad; For cooling purposes only, do not use as an
electrical ground.
1)
1) The exposed die pad at the bottom of the package allows better power dissipation of heat from the SBC via the PCB.
The exposed die pad is not connected to any active part of the IC an can be left floating or it can be connected to GND
(recommended) for the best EMC performance.
Pin
Symbol
Function
