v
Contents
1
Product Description .............................................................. 9
1.1
Overview.......................................................................................... 9
1.1.1
Feature Summary .................................................................. 9
1.1.2
Board Layout ....................................................................... 11
1.1.3
Block Diagram ..................................................................... 13
1.2
Online Support................................................................................ 14
1.3
Processor ....................................................................................... 14
1.3.1
Intel D425 Graphics Subsystem.............................................. 15
1.4
System Memory .............................................................................. 16
1.5
Intel
®
NM10 Express Chipset............................................................. 17
1.5.2
USB ................................................................................... 19
1.5.3
SATA Support ...................................................................... 19
1.6
Real-Time Clock Subsystem .............................................................. 20
1.7
Legacy I/O Controller ....................................................................... 20
1.8
LAN Subsystem............................................................................... 21
1.8.1
LAN Subsystem Drivers ......................................................... 21
1.8.2
RJ-45 LAN Connector with Integrated LEDs .............................. 22
1.9
Audio Subsystem............................................................................. 23
1.9.1
Audio Subsystem Software .................................................... 24
1.9.2
Audio Connectors and Headers ............................................... 24
1.10
Hardware Management Subsystem .................................................... 25
1.10.1
Hardware Monitoring............................................................. 25
1.10.2
Thermal Monitoring .............................................................. 26
1.11
Power Management ......................................................................... 27
1.11.1
ACPI................................................................................... 27
1.11.2
Hardware Support ................................................................ 30
2
Technical Reference............................................................ 33
2.1
Memory Map................................................................................... 33
2.1.1
Addressable Memory............................................................. 33
2.2
Connectors and Headers................................................................... 36
2.2.1
Back Panel .......................................................................... 37
2.2.2
Component-side Connectors and Headers ................................ 39
2.3
BIOS Configuration Jumper Block....................................................... 49
2.4
Mechanical Considerations ................................................................ 51
2.4.1
Form Factor......................................................................... 51
2.5
Electrical Considerations................................................................... 52
2.5.1
Fan Header Current Capability................................................ 52
2.5.2
Add-in Board Considerations .................................................. 52
2.6
Thermal Considerations .................................................................... 52
2.6.1
Passive Heatsink Design in a Passive System Environment ......... 54