TABLE OF TABLES
xviii
Table 11-12.
GTL+ Signal Groups Ringback Tolerance . . . . . . . . . . . . . . . . . . . . . . . . . .11-20
Table 11-13.
3.3V Tolerant Signal Groups A.C. Specifications . . . . . . . . . . . . . . . . . . . . .11-20
Table 11-14.
Reset Conditions A.C. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11-21
Table 11-15.
APIC Clock and APIC I/O A.C. Specifications . . . . . . . . . . . . . . . . . . . . . . .11-22
Table 11-16.
Boundary Scan Interface A.C. Specifications . . . . . . . . . . . . . . . . . . . . . . . .11-23
Table 11-17.
Flexible Motherboard (FMB) Power Recommendations . . . . . . . . . . . . . . .11-28
Table 12-1.
System DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-3
Table 12-2.
System Topological Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-4
Table 12-3.
Specifications for Signal Quality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-5
Table 12-4.
I/O Buffer DC Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-13
Table 12-5.
I/O Buffer AC Parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-14
Table 13-1.
Signal Ringback Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-2
Table 14-1.
Case-To-Ambient Thermal Resistance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-4
Table 14-2.
Ambient Temperatures Required at Heat Sink for 29.2W and 85° Case . . . . 14-5
Table 14-3.
Ambient Temperatures Required at Heat Sink for 40W and 85° Case. . . . . . 14-5
Table 15-1.
Pentium
®
Pro Processor Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-3
Table 15-2.
Pin Listing in Pin # Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-5
Table 15-3.
Pin Listing in Alphabetic Order . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15-9
Table 16-1.
Debug Port Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-2
Table 16-2.
TCK Pull-Up Value . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16-5
Table 17-1.
OverDrive
®
Processor Signal Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . 17-4
Table 17-2.
Header 8 Pin Reference . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17-10
Table 17-3.
OverDrive
®
Processor CPUID. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17-14
Table 17-4.
OverDrive
®
Processor D.C. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . .17-15
Table 17-5.
OverDrive
®
VRM Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17-16
Table 17-6.
OverDrive
®
VRM Power Dissipation for Thermal Design . . . . . . . . . . . . . . .17-18
Table 17-7.
OverDrive
®
Processor Thermal Resistance and Maximum Ambient
Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17-19
Table 17-8.
Electrical Test Criteria for Systems Employing Header 8 . . . . . . . . . . . . . . .17-21
Table 17-9.
Electrical Test Criteria for Systems Not Employing Header 8 . . . . . . . . . . .17-21
Table 17-10.
Electrical Test Criteria for all Systems . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17-22
Table 17-11.
Thermal Test Criteria . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17-23
Table 17-12.
Mechanical Test Criteria for the OverDrive
®
Processor . . . . . . . . . . . . . . . .17-23
Table 17-13.
Functional Test Criteria. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17-24
Table A-1.
ASZ[1:0]# Signal Decode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-4
Table A-2.
ATTR[7:0]# Field Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-5
Table A-3.
Special Transaction Encoding on BE[7:0]# . . . . . . . . . . . . . . . . . . . . . . . . . . A-5
Table A-4.
BR0#(I/O), BR1#, BR2#, BR3# Signals Rotating Interconnect. . . . . . . . . . . . A-8
Table A-5.
BR[3:0]# Signal Agent IDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-9
Table A-6.
DID[7:0]# Encoding. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-12
Table A-7.
EFX[4:0]# Signal Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-13
Table A-8.
LEN[1:0]# Signals Data Transfer Lengths . . . . . . . . . . . . . . . . . . . . . . . . . . A-16
Table A-9.
Transaction Types Defined by REQa#/REQb# Signals . . . . . . . . . . . . . . . . A-18
Table A-10.
Transaction Response Encodings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-20
Table A-11.
Output Signals1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-24
Table A-12.
Input Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-24
Table A-13.
Input/Output Signals (Single Driver) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-25
Table A-14.
Input/Output Signals (Multiple Driver). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-27
Summary of Contents for Pentium Pro Family
Page 17: ...1 Component Introduction ...
Page 26: ...2 Pentium Pro Processor Architecture Overview ...
Page 27: ......
Page 36: ...3 Bus Overview ...
Page 62: ...4 Bus Protocol ...
Page 105: ...5 Bus Transactions and Operations ...
Page 126: ...6 Range Registers ...
Page 131: ...7 Cache Protocol ...
Page 135: ...8 Data Integrity ...
Page 148: ...9 Configuration ...
Page 161: ...10 Pentium Pro Processor Test Access Port TAP ...
Page 172: ...11 Electrical Specifications ...
Page 201: ...12 GTL Interface Specification ...
Page 229: ...13 3 3V Tolerant Signal Quality Specifications ...
Page 233: ...14 Thermal Specifications ...
Page 239: ...15 Mechanical Specifications ...
Page 241: ...15 2 MECHANICAL SPECIFICATIONS s Figure 15 1 Package Dimensions Bottom View ...
Page 252: ...16 Tools ...
Page 260: ...16 8 TOOLS Figure 16 4 Generic MP System Layout for Debug Port Connection ...
Page 264: ...17 OverDrive Processor Socket Specification ...
Page 290: ...A Signals Reference ...
Page 320: ...Index ...
Page 328: ......