17-17
OVERDRIVE® PROCESSOR SOCKET SPECIFICATION
17.4.3.
A.C. Specifications
Except for internal CPU core Clock frequency, the OverDrive processor will operate within the
same A.C. specifications as the Pentium Pro processor.
17.5.
THERMAL SPECIFICATIONS
This section describes the cooling solution utilized by the OverDrive processor and the cool-
ing requirements for both the processor and VRM. Heat dissipation by the OverDrive proces-
sor will be no greater than the Pentium Pro processor, as described in Chapter 14, Thermal
Specifications.
17.5.1.
OverDrive
®
Processor Cooling Requirements
The OverDrive processor will be cooled with a fan/heatsink cooling solution. The OverDrive
processor will operate properly when the preheat temperature, TPH, is a maximum of 50ºC
(TPH is the temperature of the air entering the fan/heatsink, measured 0.3” above the center of
the fan — See Figure 17-4). When the preheat temperature requirement is met, the fan/heatsink
will keep the case temperature, TC, within the specified range, provided airflow through the
fan/heatsink is unimpeded (see Section 17.2.2.2., “Socket 8 Space Requirements”).
It is strongly recommended that testing be conducted to determine if the fan inlet temperature
requirement is met at the system maximum ambient operating temperature.
NOTE
The OverDrive processor will operate properly when the preheat temperature,
TPH, is a maximum of 50°C (TPH is the temperature of the air entering the
fan/heatsink, measured 0.3” above the center of the fan — See Figure 17-4).
17.5.1.1.
FAN/HEATSINK COOLING SOLUTION
A height of 0.4" airspace above the fan/heatsink unit and a distance of 0.2” around all four sides
of the OverDrive processor is REQUIRED to ensure that the airflow through the fan/heatsink is
not blocked. The fan/heatsink will reside within the boundaries of the surface of the chip. Block-
ing the airflow to the fan/heatsink reduces the cooling efficiency and decreases fan life.
Figure 17-4 illustrates an acceptable airspace clearance above the fan/heatsink and around the
OverDrive processor package.
17.5.2.
OEM Processor Cooling Requirements
The OEM processor cooling solution must not impede the upgradability of the system. For
example:
Summary of Contents for Pentium Pro Family
Page 17: ...1 Component Introduction ...
Page 26: ...2 Pentium Pro Processor Architecture Overview ...
Page 27: ......
Page 36: ...3 Bus Overview ...
Page 62: ...4 Bus Protocol ...
Page 105: ...5 Bus Transactions and Operations ...
Page 126: ...6 Range Registers ...
Page 131: ...7 Cache Protocol ...
Page 135: ...8 Data Integrity ...
Page 148: ...9 Configuration ...
Page 161: ...10 Pentium Pro Processor Test Access Port TAP ...
Page 172: ...11 Electrical Specifications ...
Page 201: ...12 GTL Interface Specification ...
Page 229: ...13 3 3V Tolerant Signal Quality Specifications ...
Page 233: ...14 Thermal Specifications ...
Page 239: ...15 Mechanical Specifications ...
Page 241: ...15 2 MECHANICAL SPECIFICATIONS s Figure 15 1 Package Dimensions Bottom View ...
Page 252: ...16 Tools ...
Page 260: ...16 8 TOOLS Figure 16 4 Generic MP System Layout for Debug Port Connection ...
Page 264: ...17 OverDrive Processor Socket Specification ...
Page 290: ...A Signals Reference ...
Page 320: ...Index ...
Page 328: ......