System Overview
Intel
®
Carrier Grade Server TIGPT1U TPS
Revision
1.0
18
2.5.4 Cooling
Subsystem
2.5.4.1 Description
All system components except the power supply are cooled by two system fan assemblies.
One fan assembly is mounted near the middle of the chassis, and a second fan assembly is
mounted to the left of hard drive bay 1. These fan assemblies are shown in Figure 2-15.
Figure 2-15. System Fan Assemblies
One fan assembly contains two 40 x 48 mm counter rotating fans that are used to cool the Intel
®
Pentium
®
4 Processor, and also contains one 40 x 28 mm fan that is used to cool the DDR
SDRAM memory and the processor Voltage Regulator Module (VRM) circuitry. Air to these
fans comes in the front of the chassis and passes over the SCSI disk drives helping to provide
cooling to the SCSI disk drives.
The other fan assembly contains one 40 x 28 mm fan that is used to cool the PCI adapter
(maximum of 25 watts) as well as the components on the SE7210TP1-E System Baseboard
that are located to the left of the Intel
®
Pentium
®
4 Processor.
Each fan provides tachometer signal output to the SE7210TP1-E System Baseboard to indicate
a fan failure.
2.5.4.2 Ambient
Temperature
Control
The SE7210TP1-E System Baseboard contains a pulse-width-modulation (PWM) circuit, which
cycles the 12 Vdc fan voltage to provide quiet operation when system ambient temperature is
low and there are no fan failures. Under normal room ambient conditions (less than 24
°
C) the
fan power circuit supplies an effective fan voltage of 6.0 Vdc. When the room ambient
temperature exceeds 24
°
C, the fan control circuit provides increased voltage levels to increase
the speed of the fan. There are
sixteen
fan speed increments between 24
°
C and 40
°
C. At 40
°
C the fans operate at their maximum speed to provide maximum airflow.
