Intel
®
5100 MCH Chipset
Intel
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG
July 2008
4
Order Number: 318676-003US
Figures
1
Thermal Design Process ............................................................................................. 7
2
MCH Package Dimensions (Top View) ..........................................................................10
3
MCH Package Dimensions (Side View) .........................................................................10
4
MCH Package Dimensions (Bottom View) .....................................................................11
5
Processor Thermal Characterization Parameter Relationships ..........................................13
6
IHS Groove Dimensions.............................................................................................17
7
Orientation of Thermocouple Groove Relative to Package Pin ..........................................18
8
Bending Tip of Thermocouple .....................................................................................18
9
Securing Thermocouple Wires with Kapton Tape Prior to Attach ......................................19
10 Thermocouple Bead Placement ...................................................................................20
11 Positioning Bead on Groove .......................................................................................20
12 Using 3D Micromanipulator to Secure Bead Location......................................................21
13 Measuring Resistance between Thermocouple and IHS ..................................................21
14 Applying Adhesive on Thermocouple Bead....................................................................22
15 Thermocouple Wire Management in Groove..................................................................23
16 Removing Excess Adhesive from IHS...........................................................................23
17 Filling Groove with Adhesive ......................................................................................24
18 Torsional Clip Heatsink Measured Thermal Performance versus Approach Velocity .............25
19 AdvancedTCA* Torsional Clip Heatsink Volumetric Envelope for MCH Heatsink ..................26
20 Torsional Clip Heatsink Assembly................................................................................27
21 Isometric View of the CompactPCI* Reference Heatsink.................................................29
22 CompactPCI* Reference Heatsink Thermal Performance.................................................30
23 AdvancedTCA* Heatsink Assembly Drawing .................................................................32
24 AdvancedTCA* Heatsink Drawing................................................................................33
25 AdvancedTCA* Component Keepout Zone ....................................................................34
26 CompactPCI* Heatsink Assembly Drawing ...................................................................35
27 CompactPCI* Heatsink Drawing..................................................................................36
28 CompactPCI* Component Keepout Zone ......................................................................37
29 Torsional Clip Heatsink Clip Drawing ...........................................................................38
30 TIM2 Drawing ..........................................................................................................39
Tables
1
Definition of Terms .................................................................................................... 7
2
Related Documents.................................................................................................... 8
3
Intel
®
5100 Memory Controller Hub Chipset Thermal Specifications.................................12
4
Required Heatsink Thermal Performance (
Ψ
CA
) .............................................................15
5
Thermocouple Attach Support Equipment ....................................................................16
6
Honeywell* PCM45F TIM Performance as Function of Attach Pressure ..............................28
7
Reliability Guidelines .................................................................................................29
8
Reliability Requirements ............................................................................................30
9
Mechanical Drawing List ............................................................................................31
10 MCH Torsional Clip Heatsink Thermal Solution ..............................................................40
