LGA1366 Socket
20
Thermal/Mechanical Design Guide
2.9
LGA1366 Socket NCTF Solder Joints
Intel has defined selected solder joints of the socket as non-critical to function (NCTF)
for post environmental testing. The processor signals at NCTF locations are typically
redundant ground or non-critical reserved, so the loss of the solder joint continuity at
end of life conditions will not affect the overall product functionality.
Figure 2-7
identifies the NCTF solder joints.
.
Note:
For platforms supporting the DP processor land C3 is CTF.
§
Figure 2-7.
LGA1366 NCTF Solder Joints
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AA AC AE AG AJ
AL AN AR AU AW BA
Summary of Contents for X5550 - Quad Core Xeon
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 24: ...Independent Loading Mechanism ILM 24 Thermal Mechanical Design Guide Figure 3 3 ILM Assembly ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 48: ...Component Suppliers 48 Thermal Mechanical Design Guide ...
Page 82: ...Mechanical Drawings 82 Thermal Mechanical Design Guide ...
Page 88: ...Socket Mechanical Drawings 88 Thermal Mechanical Design Guide ...
