Thermal Solutions
32
Thermal/Mechanical Design Guide
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H
2
O.
4. Reference system configuration. Processor is downstream from memory in EEB (Entry-Level Electronics Bay).
Ducting is utilized to direct airflow.
5. The 1U heatsink can also meet Profile B for the 95W processor in TEB (Thin Electronics Bay) under the
following conditions: TLA = 40ºC, CA = 0.275ºC/W, airflow = 16 CFM @ 0.344” dP (these TEB values are
not used to generate processor thermal specifications). Processor is not downstream from memory in TEB.
Ducting is utilized to direct airflow.
6. Dimensions of heatsink do not include socket or processor.
7. The 2U heatsink height (64mm) + socket/processor height (7.729 mm,
Table 4-2
) complies with 76.2 mm
max height for EEB monoplanar boards (http://ssiforum.org/).
8. Passive heatsinks. PCM45F thermal interface material.
9. WS = Workstation.
Table 5-1
and
Table 5-2
specify
CA
and pressure drop targets for specific airflows. To
determine
CA
and pressure drop targets for other airflows, use Best-fit equations in
Figure 5-1
. Heatsink detailed drawings are in Appendix B.
5.1.1
25.5 mm Tall Heatsink
For the 25.5 mm tall heatsink,
Table 5-3
provides guidance regarding performance
expectations. These values are not used to generate processor thermal specifications.
Notes:
1. Local ambient temperature of the air entering the heatsink.
2. Max target (mean + 3 sigma + offset) for thermal characterization parameter (
Section 5.5.1
).
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H
2
O.
4. Reference system configuration. Processor is downstream from memory in SSI blade and EEB (Entry-Level
Electronics Bay), not in TEB (Thin Electronics Bay). Ducting is utilized to direct airflow.
Figure 5-1.
Best-fit Equations
Table 5-3.
Performance Expectations for Intel Xeon Processor 5500 Series with 25.5 mm
Tall Heatsink
Parameter
Value
Altitude, system
ambient temp
Sea level, 35
o
C
TDP
95W, Profile B
T
LA
1
50
o
C
49
o
C
40
o
C
CA
2
0.296
o
C/W
0.333
o
C/W
0.278
o
C/W
Airflow
3
13.3 CFM @ 0.329” dP
10 CFM @ 0.239” dP
16 CFM @ 0.406” dP
System height
(form factor)
4
SSI blade
1U (EEB)
1U (TEB)
Heatsink
volumetric
90 x 90 x 25.5mm (1U)
5
Heatsink
technology
6
Cu base, Al fins
Summary of Contents for X5550 - Quad Core Xeon
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 24: ...Independent Loading Mechanism ILM 24 Thermal Mechanical Design Guide Figure 3 3 ILM Assembly ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 48: ...Component Suppliers 48 Thermal Mechanical Design Guide ...
Page 82: ...Mechanical Drawings 82 Thermal Mechanical Design Guide ...
Page 88: ...Socket Mechanical Drawings 88 Thermal Mechanical Design Guide ...
