Thermal Solutions
34
Thermal/Mechanical Design Guide
5.3
Assembly
The assembly process for the 1U reference heatsink begins with application of
Honeywell PCM45F thermal interface material to improve conduction from the IHS.
Tape and roll format is recommended. Pad size is 35 x 35mm, thickness is 0.25mm.
Next, position the heatsink such that the heatsink fins are parallel to system airflow.
While lowering the heatsink onto the IHS, align the four captive screws of the heatsink
to the four threaded nuts of the back plate.
Using a #2 Phillips driver, torque the four captive screws to 8 inch-pounds. Fastener
sequencing (starting threads on all four screws before torquing) may mitigate against
cross threading.
This assembly process is designed to produce a static load of 39 - 51 lbf, for 0.062" -
0.100" board thickness respectively. Honeywell PCM45F is expected to meet the
performance targets in
Table 5-1
from 30 - 60 lbf. From
Table 4-3
, the Heatsink Static
Compressive Load of 0 - 60 lbf allows for designs that vary from the 1U reference
heatsink. Example: A customer’s unique heatsink with very little static load (as little as
0 lbf) is acceptable from a socket loading perspective as long as the T
CASE
specification
is met.
Compliance to Board Keepout Zones in
Appendix B
is assumed for this assembly
process.
Figure 5-3.
1U Reference Heatsink Assembly
Summary of Contents for X5550 - Quad Core Xeon
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 24: ...Independent Loading Mechanism ILM 24 Thermal Mechanical Design Guide Figure 3 3 ILM Assembly ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 48: ...Component Suppliers 48 Thermal Mechanical Design Guide ...
Page 82: ...Mechanical Drawings 82 Thermal Mechanical Design Guide ...
Page 88: ...Socket Mechanical Drawings 88 Thermal Mechanical Design Guide ...
