Thermal Solutions
36
Thermal/Mechanical Design Guide
5.5.2
Dual Thermal Profile
Processors that offer dual thermal profile are specified in the appropriate datasheet.
Dual thermal profile helps mitigate limitations in volumetrically constrained form
factors and allows trade-offs between heatsink cost and TCC activation risk. For
heatsinks that comply to Profile B, yet do not comply to Profile A (1U heatsink in
Figure 5-5
), the processor has an increased probability of TCC activation and an
associated measurable performance loss. Measurable performance loss is defined to be
any degradation in processor performance greater than 1.5%. 1.5% is chosen as the
baseline since run-to-run variation in a performance benchmark is typically between 1
and 2%.
Figure 5-4.
Processor Thermal Characterization Parameter Relationships
Summary of Contents for X5550 - Quad Core Xeon
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 24: ...Independent Loading Mechanism ILM 24 Thermal Mechanical Design Guide Figure 3 3 ILM Assembly ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 48: ...Component Suppliers 48 Thermal Mechanical Design Guide ...
Page 82: ...Mechanical Drawings 82 Thermal Mechanical Design Guide ...
Page 88: ...Socket Mechanical Drawings 88 Thermal Mechanical Design Guide ...
