Thermal/Mechanical Design Guide
39
Thermal Solutions
Using a smaller averaging constant could cause premature detection of failure.
The Critical Temperature threshold generally triggers somewhere between PECI of
-0.75 and -0.50. To avoid false shutdowns, initiate soft shutdown at -0.25.
Since customer designs, boundary conditions, and failure scenarios differ, above
guidance should be tested in the customer’s system to prevent loss of data during
shutdown.
5.6.3
Intel® Turbo Boost Technology
Intel® Turbo Boost Technology (Intel® TBT) is a new feature available on certain
processor SKUs that opportunistically, and automatically, allows the processor to run
faster than the marked frequency if the part is operating below its power, temperature
and current limits.
Heatsink performance (lower
CA
as described in
Section 5.5.1
) is one of several
factors that can impact the amount of Intel TBT frequency benefit. Intel TBT
performance is also constrained by ICC, and VCC limits.
Increased IMON accuracy may provide more Intel TBT benefit on TDP limited
applications, as compared to lower
CA
, as temperature is not typically the limiter for
these workloads.
With Intel TBT enabled, the processor may run more consistently at higher power levels
(but still within TDP), and be more likely to operate above T
CONTROL
, as compared to
when Intel TBT is disabled. This may result in higher acoustics.
With Intel TBT enabled, processors with dual thermal profiles (described in
Section 5.5.2
, have greater potential for performance delta between Profile A and
Profile B platforms, as compared to previous platforms.
5.7
Thermal Guidance
5.7.1
Thermal Excursion Power for Processors with Dual
Thermal Profile
Under fan failure or other anomalous thermal excursions, Tcase may exceed Thermal
Profile B for a duration totaling less than 360 hours per year without affecting long term
reliability (life) of the processor. For more typical thermal excursions, Thermal Monitor
is expected to control the processor power level as long as conditions do not allow the
Tcase to exceed the temperature at which Thermal Control Circuit (TCC) activation
initially occurred. Under more severe anomalous thermal excursions when the
processor temperature cannot be controlled at or below this Tcase level by TCC
activation, then data integrity is not assured. At some higher threshold, THERMTRIP#
will enable a shut down in an attempt to prevent permanent damage to the processor.
Thermal Test Vehicle (TTV) may be used to check anomalous thermal excursion
compliance by ensuring that the processor Tcase value, as measured on the TTV, does
not exceed Tcase_max_B at the anomalous power level for the environmental condition
of interest. This anomalous power level is equal to 75% of the TDP limit.
This guidance can be applied to 95W Intel Xeon processor 5500 series and 95W Intel
Xeon processor 5600 series.
Summary of Contents for X5550 - Quad Core Xeon
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Page 24: ...Independent Loading Mechanism ILM 24 Thermal Mechanical Design Guide Figure 3 3 ILM Assembly ...
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Page 48: ...Component Suppliers 48 Thermal Mechanical Design Guide ...
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