Quality and Reliability Requirements
42
Thermal/Mechanical Design Guide
8a) Thermal
Performance for
Intel® Xeon®
Processor 5500 Series
Using 1U heatsink and 1U airflow from
Table 5-1
:
1) TTV @ 95W (Profile B), Note 1.
Using 2U heatsink and 2U airflow from
Table 5-1
:
2) TTV @ 95W (Profile A), Note 1.
3) TTV @ 80W.
4) TTV @ 60W.
Using Tower heatsink and Tower airflow
from
Table 5-1
:
5) TTV @ 130W, Note 1.
6) TTV @ 95W (Profile A).
7) TTV @ 80W.
8) TTV @ 60W.
As verified in wind tunnel:
1) mean
CA
+ 3s + offset not to exceed
Table 5-1
value for 95W in 1U.
2-4) mean
CA
+ 3s + offset not to exceed
Table 5-1
value for 2U.
5-8) mean
CA
+ 3s + offset not to exceed
Table 5-1
value for Tower.
5 heatsinks
X 8 tests by
supplier.
Note 1: 30
heatsinks X
3 tests by
Intel.
8b) Thermal
Performance for
Intel® Xeon®
Processor 5600 Series
Using 1U heatsink and 1U airflow from
Table 5-2
:
1) TTV @ 95W (Profile B), Note 1.
Using 2U heatsink and 2U airflow from
Table 5-2
:
2) TTV @ 130W, Note 1.
3) TTV @ 95W (Profile A).
4) TTV @ 80W.
5) TTV @ 60W.
As verified in wind tunnel:
1) mean
CA
+ 3s + offset not to exceed
Table 5-2
value for 95W in 1U.
2-5) mean
CA
+ 3s + offset not to exceed
Table 5-2
value for 2U.
Thermal
Test data
re-assessed
from Intel®
Xeon®
Processor
5500 Series
Qualification
9) Thermal Cycling
Required for heatpipe designs.
Temperature range at pipe in heatsink
assembly: -25C to +100C for 500 cycles.
Cycle time is 30 minutes per full cycle,
divided into half cycle in hot zone and half
in cold zone, with minimum 1min soak at
each temperature extreme for each cycle.
See
Figure 6-1
for example profile.
As verified in wind tunnel:
•
Mean
CA
+ 3s + offset not to exceed
value in
Table 5-1
and
Table 5-2
.
•
Pressure drop not to exceed value in
Table 5-1
and
Table 5-2
.
15
10) Heat Pipe Burst
Continuously raise oven temperature and
record the burst/leak temperatures of fully
assembled heatsinks
No failures at minimum of 300C @ 20
minutes
32 pipes
11) Heatsink Mass
Design Target < 500 g
All samples < 550 g
30
12) Heatsink Load
Design Targets:
0.062" board = 38.7 ± 7.2 lbf (Fmin =
31.5 lbf).
0.100" board = 51.4 ± 7.9 lbf (Fmax =
59.3 lbf).
No samples < 30 lbf on 0.062" board.
5 highest load samples (from 0.062" test)
< 60 lbf on 0.100" board
30
Table 6-1.
Heatsink Test Conditions and Qualification Criteria (Sheet 2 of 2)
Assessment
Test Condition
Qualification Criteria
Min
Sample
Size
Summary of Contents for X5550 - Quad Core Xeon
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 24: ...Independent Loading Mechanism ILM 24 Thermal Mechanical Design Guide Figure 3 3 ILM Assembly ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 48: ...Component Suppliers 48 Thermal Mechanical Design Guide ...
Page 82: ...Mechanical Drawings 82 Thermal Mechanical Design Guide ...
Page 88: ...Socket Mechanical Drawings 88 Thermal Mechanical Design Guide ...
