Thermal/Mechanical Design Guide
9
Introduction
1
Introduction
This document provides guidelines for the design of thermal and mechanical solutions
for 2-socket server and 2-socket Workstation processors listed in the Intel® Xeon®
Processor 5500 Series Datasheet, Volume 1 and in the Intel® Xeon® Processor 5600
Series Datasheet, Volume 1. The components described in this document include:
• The processor thermal solution (heatsink) and associated retention hardware.
• The LGA1366 socket and the Independent Loading Mechanism (ILM) and back
plate.
Processors in 1-socket Workstation platforms are covered in the Intel
®
Core™ i7-900
Desktop Processor Extreme Edition Series and Intel
®
Core™ i7-900 Desktop Processor
Series, Intel
®
Xeon
®
Processor 3500 Series and LGA1366 Socket Thermal / Mechanical
Design Guide.
The goals of this document are:
• To assist board and system thermal mechanical designers.
• To assist designers and suppliers of processor heatsinks.
Thermal profiles and other processor specifications are provided in the Datasheet.
Figure 1-1. Intel® Xeon® 5500 Platform Socket Stack
Summary of Contents for X5550 - Quad Core Xeon
Page 8: ...8 Thermal Mechanical Design Guide ...
Page 12: ...Introduction 12 Thermal Mechanical Design Guide ...
Page 24: ...Independent Loading Mechanism ILM 24 Thermal Mechanical Design Guide Figure 3 3 ILM Assembly ...
Page 26: ...Independent Loading Mechanism ILM 26 Thermal Mechanical Design Guide ...
Page 48: ...Component Suppliers 48 Thermal Mechanical Design Guide ...
Page 82: ...Mechanical Drawings 82 Thermal Mechanical Design Guide ...
Page 88: ...Socket Mechanical Drawings 88 Thermal Mechanical Design Guide ...
