IRDC3898-P3V3
8/15/2013
Confidential
This evaluation board is a preliminary version meant for the engineering evaluation of the IR3898.
Based on the results of the continuing evaluation, this board can evolve and change without notice
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PCB METAL AND COMPONENT PLACEMENT
Evaluations have shown that the best overall performance is achieved using the substrate/PCB layout
as shown in following figures. PQFN devices should be placed to an accuracy of 0.050mm on both X
and Y axes. Self-centering behavior is highly dependent on solders and processes, and experiments
should be run to confirm the limits of self-centering on specific processes.
For further information, please
refer to “SupIRBuck™ Multi-Chip Module (MCM) Power Quad Flat No-Lead (PQFN) Board Mounting
Application Note
.” (AN1132)
Figure 20: PCB Metal Pad Spacing (all dimensions in mm)
