2
AN1473.1
May 10, 2010
Board Design Schematic
FIGURE 1. SCHEMATIC
C1
22µF
C6
4700pF
R1
88.7k
R2
10k
C4
27nF
C3
22µF
D1
FY0504SA
L1
10µH
1
VIN (2.3V to 5.5V)
CON1
1
GNDIN
CON1
R3
1k
C2
0.1µF
1
V
OUT
(12V)
CON1
1
2
4
3
S1
SW DIP-2
R4
10k
R5
10k
COMP
1
FB
2
EN
3
GND
4
GND
5
LX
6
LX
7
IN
8
FREQ
9
SS
10
ISL97656
ISL97656
C7
CAP
NOTE: The thermal pad should connect to signal ground. Both grounds should connect at pins 4 and 5.
TABLE 2. ISL97656IRTZEVALZ BILL OF MATERIALS (BOM)
ITEM
QTY
REFERENCE
PART DESCRIPTION
PCB FOOTPRINT
PART NUMBER
VENDOR
1
1
C4
27nF
603
TDK
2
1
C6
4700pF
603
TDK
3
1
C2
0.1µF/16V
603
C1068X7R1H104K
TDK
4
1
R1
88.7k
603
WALSIN
5
3
R2, R4, R5
10k
603
WR06W1002JTL
WALSIN
6
1
R3
1k
603
8
1
C3
22µF
1206
GRM31CR61C226KE15L
MURATA
9
1
C1
22µF
1206
GRM31CR61C226KE15L
MURATA
10
1
L1
10µH
SLF12575
SLF12575T-100M5R4-PF
TDK
11
1
U1
IC
TDFN-10
ISL97656
INTERSIL
12
OPEN
C7
CAP
13
1
VOUT (12V)
CON1
Powerpost
14
1
VIN (2.3V to 5.5V)
CON1
Powerpost
15
1
GNDIN
CON1
Powerpost
16
1
D1
FYD054SA
DPAK
FYD0504SATM
Fairchild
17
1
ISL97656
ISL97656
TDFN-10
INTERSIL
18
1
S1
SW DIP-2
DIP4
CKN3001-ND
Application Note 1473
