Open-Q™ 845 µSOM Development Kit User Guide
Version 1.0
© Copyright Intrinsyc Technologies Corporation
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3.6
Open-Q 845 µSOM
The Open-Q 845 µSOM contains the core Snapdragon 845 architecture. Measuring in at 50mm x
25mm, the SOM is where all the processing occurs. It is connected to the carrier board via three 100
pin Hirose DF40 connectors which allows essential power rails and signals to be exposed for
supporting other peripherals and interfaces on the platform.
For detailed information about the Open-Q 845 µSOM, see the device specification noted as
reference document R-1.
3.7
Open-Q 845 Carrier Board
The Open-Q 845 Carrier board is a Mini-ITX form factor board with various connectors used for
connecting different peripherals. The table and sections below provide in depth information on the
carrier board properties, user interfaces, connectors, and expansion headers found on the carrier
board. This information is important for users wishing to connect other external hardware devices to
the Open-Q 845 µSOM Development Kit. Users must ensure that before connecting any hardware
device to the development kit, that it is compatible with the Open-Q 845 hardware specifications.
See Figure 1 for position on carrier board.
Table 2. Carrier Board Features
Item
Position
Description
Specification
Usage
Form Factor
Dimensions: 170mm x 170mm
Mini-ITX Form Factor
SOM Interface
33
3 x 100-pin Hirose DF40 connectors
SOM power and signal IO
connection to carrier board.
The Open-Q 845 SOM
connects to the carrier board
through this interface.
Power
1
AC / Barrel charger
12 V DC Power Supply
Power Supply
Power
3
Battery connector for single cell
lithium battery
Input power option
Debug Serial via USB
12
Debug Serial UART console over
USB for development
USB Micro B connector
Development Serial
Connector for debug output
via USB
Buttons
7
General Purpose SW button
SMD Button
Additional button for
general purpose
7
Power Button
SMD Button
Power Button for Suspend /
Resume and Power off
Volume Keys
7
key
SMD Button
Key
7
Volume – key
SMD Button
Volume – Key
Sensor Connector
21
24 pin Sensor Expansion Connector
Available via Intrinsyc
optional accessories kit
Digital IO Expansion
Header
23
Exposes general purpose IO for user
development
Audio Headset Jack
8
Audio Headset Jack
Audio Headset
Audio Inputs
Expansion
27
Audio Inputs Header
3 Analog Differential Inputs,
3 PDM Input Interfaces with
phantom power
Microphones
Audio Outputs
Expansion
26
Audio Outputs Header
2 Line outputs, 1 earphone
amplifier output, 1 Soundwire
interface
Amplifiers
Audio I/O
10
Audio I/O headers
3 x I2S, 1x Analog
Differential Input
Various audio I/O functions
Haptic motor header
9
Haptic device driver
LRM and ERA capable
output driver
Haptic motor
Micro SD (on bottom)
22
Micro SD card
4bit Micro SD card support
External Storage