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Open-Q™ 845 µSOM Development Kit User Guide 

Version 1.0 

 

 

© Copyright Intrinsyc Technologies Corporation 

4 of 30

 

 

3.7.24

 

Haptic Output Header J802 (9) ................................................................................ 30

 

 
 
 

List of Figures 

Figure 1. Assembled Open-Q 845 µSOM Development Kit ................................................................. 9

 

Figure 2. Open-Q 845 µSOM Dev Kit Block Diagram ....................................................................... 11

 

Figure 3. DIP switch assignments ........................................................................................................ 16

 

Figure 4. Input Power Selection Locations .......................................................................................... 17

 

Figure 5. SOM Current Sense Header J301 (5) ................................................................................... 19

 

Figure 6. Mini-PCIe USB Enable DIP Switch (6) ............................................................................... 22

 

Figure 7. Micro SD Card Socket J1500 ............................................................................................... 22

 

Figure 8. Display Connector J1400 ...................................................................................................... 23

 

Figure 9. Typical Connection for Camera Flash Connector ................................................................ 25

 

Figure 10. Mini-PCIe and Optional SIM Card Sockets ....................................................................... 25

 

 

 

List of Tables 

Table 1. List of Development Kit Features itemized in the figure above ............................................ 10

 

Table 2. Carrier Board Features ........................................................................................................... 14

 

Table 3 - Boot Configuration DIP Switch Settings .............................................................................. 16

 

Table 4 – Battery ID / Thermistor Configuration DIP Switch Settings ............................................... 17

 

Table 5. Battery Connector J300 Pinout .............................................................................................. 18

 

Table 6 - Power Header J301 Pinout.................................................................................................... 19

 

Table 7. Power Header J700 (36) ......................................................................................................... 20

 

Table 8. Development Kit Buttons (7) ................................................................................................. 21

 

Table 9. Development Kit LEDs (36) .................................................................................................. 21

 

Table 10. Camera Flash Connectors pinout ......................................................................................... 24

 

Table 11. Digital IO Expansion Header J2200 Pinout ......................................................................... 26

 

Table 12 - Sensor Expansion Header J2100 Pinout ............................................................................. 26

 

Table 13. Audio Inputs Expansion Header Pinout J1900 .................................................................... 27

 

Table 14. Audio Outputs Expansion Header Pinout J1901.................................................................. 28

 

Table 15. Audio IO Expansion Header Pinout J2000 .......................................................................... 28

 

Table 16. Haptic Output Header Pinout J802 ...................................................................................... 30

 

 
 

Summary of Contents for Open-Q 845 mSOM

Page 1: ...y in support of your permitted use of the Open Q 845 Development Kit under the Agreement Distribution of this document is strictly prohibited without the express written permission of Intrinsyc Technologies Corporation and its respective licensors which they can withhold condition or delay in its sole discretion Intrinsyc is a trademark of Intrinsyc Technologies Corporation registered in Canada an...

Page 2: ...right Intrinsyc Technologies Corporation 2 of 30 IDENTIFICATION Document Title Open Q 845 µSOM Development Kit User Guide Document Number ITC 01DEV1430 UG 001 Version 1 0 Date Oct 7 2019 History REVISION DATE DESCRIPTION PAGES 1 0 Oct 7 2019 Initial Release All ...

Page 3: ...7 2 Boot Configuration DIP Switch S2600 37 15 3 7 3 Input Power Selection 16 3 7 4 SOM Current Sense Header J301 35 18 3 7 5 Coin Cell Battery Holder B300 30 19 3 7 6 Power Header J700 36 20 3 7 7 User Buttons and LEDs 7 36 20 3 7 8 Debug Serial UART over USB J1600 12 21 3 7 9 USB 3 1 Type C for ADB J2300 11 21 3 7 10 USB 3 1 Type A Connector J2400 5 21 3 7 11 Micro SD Card Socket J1500 22 22 3 7 ...

Page 4: ...onal SIM Card Sockets 25 List of Tables Table 1 List of Development Kit Features itemized in the figure above 10 Table 2 Carrier Board Features 14 Table 3 Boot Configuration DIP Switch Settings 16 Table 4 Battery ID Thermistor Configuration DIP Switch Settings 17 Table 5 Battery Connector J300 Pinout 18 Table 6 Power Header J301 Pinout 19 Table 7 Power Header J700 36 20 Table 8 Development Kit But...

Page 5: ...d information on this and other Intrinsyc development kits on the Intrinsyc web site https www intrinsyc com development kits 1 2 Scope This document will cover the following items on the Open Q 845 µSOM Development Kit Block Diagram and Overview Hardware Features Configuration SOM Carrier Board Available peripherals 1 3 Intended Audience This document is intended for users who would like to devel...

Page 6: ... Q 845 µSOM Schematics SOM and Carrier R 4 Open Q 845 µSOM Development Kit Display Adapter Design Guide R 5 Open Q 845 µSOM Development Kit Camera Adapter Design Guide R 6 Open Q 845 µSOM Development Kit Battery Charging Tech Note 2 3 Terms and Acronyms Term and acronyms Definition AMIC Analog Microphone ANC Audio Noise Cancellation B2B Board to Board BT LE Bluetooth Low Energy CSI Camera Serial I...

Page 7: ...ATA Serial ATA SLIMBUS Serial Low power Inter chip Media Bus SOM System on Module SPMI System Power Management Interface Qualcomm PMIC baseband proprietary protocol SSBI Single wire serial bus interface Qualcomm proprietary mostly PMIC Companion chip and baseband processor protocol UART Universal Asynchronous Receiver Transmitter UFS Universal Flash Storage UIM User Identity module USB Universal S...

Page 8: ...es applicable for Radio devices being placed on the market FCC equipment authorization rules or other regulations pertaining to consumer devices being placed on the market for use by the general public This development platform may only be used in a controlled user environment where operators have obtained the necessary regulatory approvals for experimentation using a radio device and have appropr...

Page 9: ...ies Corporation 9 of 30 3 4 1 Important Locations The diagram below shows the locations of key components interfaces and controls 2 1 4 3 29 30 34 5 8 9 10 11 12 7 13 14 17 20 16 19 15 37 36 21 22 27 23 26 18 28 32 31 33 38 6 25 24 35 Figure 1 Assembled Open Q 845 µSOM Development Kit ...

Page 10: ...mera 1 Connector J1000 16 Camera 2 Connector J1100 17 Camera 3 Connector J1200 18 Camera 4 Connector J1300 19 Flash 1 Header J1001 20 Flash 2 Header J1201 21 Sensors Expansion Header J2100 22 Micro SD card socket on bottom side of Carrier Board J1500 23 Digital IO Expansion Header J2200 24 Mini PCIe Card Connector on bottom side of Carrier Board J2801 25 SIM Card Socket for Mini PCIe on bottom sid...

Page 11: ...UFS flash 64 32GB LPDDR4X RAM PoP 4GB DSI 0 Debug UART USB1 HS SDC2 SSC EBI 0 3 BLSP GPIO Digital Audio Expansion Header WiFi BT Ant Connectors WCN baseband FTDI Serial USB VBUS To Battery Charge Circuits 4 Lane MIPI CSI CSI 2 CSI 1 CSI 0 DSI 1 I2S Audio Out GPIO Expansion Header BLSP GPIO PCB Trace Antenna PCB Trace Antenna U FL U FL U FL Boot Mode Switches SOM Power Probe Pwr Pwr Coin Cell Boot ...

Page 12: ...of 30 3 4 3 Optional Accessories Optional accessories are available for the Open Q 845 µSOM Development Kit like LCD Panel Camera adapter and sensor board Please visit the Intrinsyc product store for availability of these accessories https shop intrinsyc com collections all or contact sales intrinsyc com ...

Page 13: ...kit serial number 3 5 2 Configuration Switch Settings The default configuration for the system configuration DIP switch S2600 is for all switches to be open or OFF For details about other configurations see section 3 7 2 3 5 3 Powering Up the Development Kit The development kit can be powered up by either using a DC power supply or by connecting a battery on connector J300 Select the desired power...

Page 14: ...Factor Dimensions 170mm x 170mm Mini ITX Form Factor SOM Interface 33 3 x 100 pin Hirose DF40 connectors SOM power and signal IO connection to carrier board The Open Q 845 SOM connects to the carrier board through this interface Power 1 AC Barrel charger 12 V DC Power Supply Power Supply Power 3 Battery connector for single cell lithium battery Input power option Debug Serial via USB 12 Debug Seri...

Page 15: ...ver control Flash control Current Sense Header 35 3 pin header Sense lines connected across 0 005 Ohm resistor To measure current consumption of SOM Mini PCI Express Connector on bottom 24 Mini PCI Express for external peripheral connectivity PCI Express Gen3 interface Can support half or full size card For external mini PCIe card WWAN SIM Card on bottom 25 WWAN SIM card connector optional For WWA...

Page 16: ...2 S2600 4 CPU boot configuration bit 2 Connected to CPU GPIO100 For default boot configuration leave open OFF Other boot configurations not supported CBL_PWR_N S2600 5 Controls the auto boot of the SOM when power is applied Default configuration is open OFF To enable auto boot of the SOM when power is applied set switch closed ON USR_DEBUG 1 S2600 6 User debug switch connected to test point TP2600...

Page 17: ... and Thermistor Configuration DIP Switch S301 4 The 2 position DIP switch S301 shown in the figure above configures the battery ID and thermistor settings The table below describes the settings for the battery ID thermistor DIP switch Table 4 Battery ID Thermistor Configuration DIP Switch Settings Function DIP Switch Description Notes BATTERY THERMISTOR S301 1 Selects whether or not a 10K ohm ther...

Page 18: ...s that are needed by 845 µSOM and carrier board peripherals 3 7 3 4 Battery Connector J300 3 For a battery powered Open Q 845 µSOM Development Kit the battery connector J300 see location in figure above is used for connection to the battery The table below describes the pinout of the battery connector For more information on powering the development kit from a battery including selecting a battery...

Page 19: ...2701 or similar and the voltages on the SOM_PWR_SENSE_P N pins are captured a few times a second over the test period typically 30 minutes The SOM power consumption is then calculated as where Rsense 5 milliohms 𝑃𝑃𝑃𝑃𝑃𝑃𝑚𝑚 𝑉𝑉𝑉𝑉𝑉𝑉𝑚𝑚𝑝𝑝𝑝𝑝𝑟𝑟𝑠𝑠𝑠𝑠𝑠𝑠𝑠𝑠𝑒𝑒𝑁𝑁 𝑉𝑉𝑉𝑉𝑉𝑉𝑚𝑚𝑝𝑝𝑝𝑝𝑟𝑟𝑠𝑠𝑠𝑠𝑠𝑠𝑠𝑠𝑒𝑒𝑃𝑃 𝑉𝑉𝑉𝑉𝑉𝑉𝑚𝑚𝑝𝑝𝑝𝑝𝑟𝑟𝑠𝑠𝑠𝑠𝑠𝑠𝑠𝑠𝑒𝑒𝑁𝑁 𝑅𝑅𝑅𝑅𝑅𝑅𝑅𝑅𝑅𝑅𝑅𝑅 Use averaging to reduce noise 3 7 5 Coin Cell Battery Holder B300 30 The coin cell ho...

Page 20: ... core 8 MB_ELDO_CAM1_VCM_2P8 5 2 8V Carrier Board LDO for Camera 2 VCM 9 MB_ELDO_CAM0_AVDD_2P8 5 2 85V Carrier Board LDO for Camera 1 AVDD 10 GND System Ground 11 MB_VREG_1P8 1 8V Carrier Board Buck Power Supply for general 1 8V rail 12 MB_VREG_3P3 3 3V Carrier Board buck boost power supply for general 3 3V rail 13 MB_ELDO_CAM2_DVDD_1P1 1 1V Carrier Board LDO for Camera 3 DVDD Camera core 14 MB_EL...

Page 21: ...igure 1 for the location of J1600 on the carrier board 3 7 9 USB 3 1 Type C for ADB J2300 11 The Open Q 845 carrier board contains one USB 3 1 Type C connection J2300 This connection is used for Android debug bridge ADB functionality To get the adb shell ensure that the board is up and running and connect the Type C cable between the board and the PC Type the command adb root and adb shell on the ...

Page 22: ...B Enable DIP Switch 6 3 7 11 Micro SD Card Socket J1500 22 J1500 Micro SD card connector provides 4 bit secure digital SD interface for external storage It is located on the bottom side of the carrier board right under the Display Module see figure below The SD interface supports High Speed mode Figure 7 Micro SD Card Socket J1500 ...

Page 23: ... can be purchased here https shop intrinsyc com products open q 810 820 lcd Exposed on the display connector are the following interfaces Two 4 lane MIPI DSI high speed display interfaces LCD backlight control signals I2C bus for touch panel support Additional GPIOs for general purposes available Various power rails for powering the display adapter For details on the signal list provided on the di...

Page 24: ... camera connectors see the development kit schematic R 3 and the camera adapter design guide technical note document R 5 3 7 14 Camera Flash Connectors J1001 19 and J1201 20 In addition to the four camera connectors the video capturing subsystem of the Open Q 845 µSOM Development Kit is equipped with two connectors for flash or torch devices J1001 and J1201 The PMI8998 power management IC has thre...

Page 25: ...ard see image below Figure 10 Mini PCIe and Optional SIM Card Sockets The Mini PCIe card socket supports both the standard full and half size PCI Express mini cards with the 4 mounting holes located below J2800 in the image above The pinout of J2800 complies with the PCI Express mini card standards Please refer to the document at the following link for more information https www pcisig com specifi...

Page 26: ...I2 _CLK CPU Sensor Core SSC_GPIO10 8 GPIO0_QUP0_L0_SPI _MISO CPU GPIO0 9 SSC11_QUP2_3_SPI2 _CS_N CPU Sensor Core SSC_GPIO11 10 GPIO1_QUP0_L1_SPI _MOSI CPU GPIO1 11 GND Ground 12 GPIO2_QUP0_L2_SPI _CLK CPU GPIO2 13 GPIO56_QUP10_1_I2 C_SCL CPU GPIO56 14 GPIO3_QUP0_L3_SPI _CS_N CPU GPIO3 15 GPIO55_QUP10_0_I2 C_SDA CPU GPIO55 16 GPIO7_LCD1_RST_N CPU GPIO7 17 GND Ground 18 GND Ground 19 No Net 20 MB_VR...

Page 27: ...System Ground 13 CDC_DMIC_CLK0 Digital Microphone 0 Clock 14 CDC_DMIC_CLK1 Digital Microphone 1 Clock 15 CDC_DMIC_DATA 0 Digital Microphone 0 Data 16 CDC_DMIC_DATA 1 Digital Microphone 1 Data 17 VREG_S4A_1P8 µSOM LDO Regulator S4A 1 8V 18 CDC_DMIC_CLK2 Digital Microphone 2 Clock 19 GND System Ground 20 CDC_DMIC_DATA 2 Digital Microphone 2 Data 3 7 19 Audio Outputs Expansion Header J1901 26 The Ope...

Page 28: ...r refer to the Open Q 845 Software Release Notes to determine feature support in the latest software release 3 7 20 Audio IO Expansion Header J2000 10 In addition to the Qualcomm Audio Codec WCD9340 28 the Open Q 845 µSOM Development Kit also includes other digital audio interfaces The Audio IO Expansion Header J2000 exposes some of these interfaces for the user See item 10 in Figure 1 for the car...

Page 29: ...tput 29 GND Ground 30 No net 31 MB_VREG_1P8 Carrier board switching regulator 1 8V 32 GND Ground 33 MB_VREG_3P3 Carrier board switching regulator 3 3V 34 GPIO54_CO DEC_INT1_ CON CPU GPIO54 see Note 1 below 35 MB_VREG_5P0 Carrier board switching regulator 5 0V 36 GPIO53_CO DEC_INT2_ CON CPU GPIO53 see Note 1 below 37 DC_IN_12V Voltage from DC Power Input 12 0V 38 No net 39 GND Ground 40 MB_VREG_1 P...

Page 30: ...re advanced antenna solution is required it is possible to connect custom antennas directly to the µSOM U FL connectors 3 7 23 Quiet Thermistor RT800 35 The Open Q 845 µSOM Development Kit includes a thermistor on the carrier board to allow for system level thermal management See item 35 in Figure 1 for the carrier board location of the Quiet Thermistor RT800 3 7 24 Haptic Output Header J802 9 The...

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