Open-Q™ 845 µSOM Development Kit User Guide
Version 1.0
© Copyright Intrinsyc Technologies Corporation
10 of 30
Table 1. List of Development Kit Features itemized in the figure above
Position Feature Description
Reference Designator
1
DC Power Supply Jack
J400
2
Power Source Selector
S300
3
Battery Input Header
J300
4
Battery Configuration DIP Switch
S301
5
USB 3.1 Type A Connector
J2400
6
Mini-PCIe USB Enable DIP Switch
S2401
7
Buttons: General Purpose / Power / Volume Up / Volume Down
S2501 / S2503 / S2500 /
S2502
8
Audio Headset Jack
J1800
9
Haptic Motor Header
J802
10
Audio I/O Header
J2000
11
USB 3.1 Type-C connector for ADB
J2300
12
USB Serial Debug Console
J1600
13
WLAN/BT Channel 0 External Antenna Connector
J2701
14
WLAN Channel 1 External Antenna Connector
J2700
15
Camera 1 Connector
J1000
16
Camera 2 Connector
J1100
17
Camera 3 Connector
J1200
18
Camera 4 Connector
J1300
19
Flash 1 Header
J1001
20
Flash 2 Header
J1201
21
Sensors Expansion Header
J2100
22
Micro SD card socket (on bottom side of Carrier Board)
J1500
23
Digital IO Expansion Header
J2200
24
Mini-PCIe Card Connector (on bottom side of Carrier Board)
J2801
25
SIM Card Socket for Mini-PCIe (on bottom side of Carrier Board)
J2800
26
Audio Outputs Expansion
J1901
27
Audio Inputs Expansion
J1900
28
Audio Codec Module (on top side of Carrier Board underneath
Display Adapter)
U1700
29
Power Header
J700
30
Coin Cell Holder
B300
31
Open-Q 845
µ
SOM, WLAN/BT CH0 Antenna Connector
J2200 (on
µ
SOM)
32
Open-Q 845
µ
SOM, WLAN CH1 Antenna Connector
J2201 (on
µ
SOM)
33
Open-Q 845
µ
SOM
34
On-Board Quiet Thermistor
RT800
35
SOM Current Sense Probe Header
J301
36
LEDs: (Charge State / Power / Blue / Green / Red)
DS2503 / DS2504 /
DS2500 / DS2501 /
DS2502
37
System Configuration DIP Switch
S2600
38
Open-Q LCD Panel
