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IRAUDAMP5 REV 3.1
IRAUDAMP5 PCB Specifications
Figure 34. Motherboard and Daughter-board Layer Stack
Daughter board:
Material:
FR4, UL 125
°
C
Layer Stack:
2 Layers, 1 oz. Cu each, Through-hole plated
Dimensions:
3.125” x 1.52” x 0.062”
Solder Mask:
LPI Solder mask, SMOBC on Top and Bottom Layers
Plating:
Open copper solder finish
Silkscreen:
On Top and Bottom Layers
Motherboard:
Material:
FR4, UL 125
°
C
Summary of Contents for IRAUDAMP5
Page 45: ...www irf com Pa Figure 39 PCB Layout Motherboard ge 44 of 50 IRAUDAMP5 REV 3 1 Top Layer ...
Page 46: ...www irf com Top silk screen Page 45 of 50 IRAUDAMP5 REV 3 1 ...
Page 47: ...www irf com Page 46 of 50 IRAUDAMP5 REV 3 1 Bottom ...
Page 48: ...www irf com Page 47 of 50 IRAUDAMP5 REV 3 1 4 0 ...
Page 49: ...www irf com Page 48 of 50 IRAUDAMP5 REV 3 1 Bottom Silkscreen 4 0 ...