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IRAUDAMP5 REV 3.1
Layer Stack:
2 Layers, 1 oz. Cu
Dimensions:
5.2” x 5.8” x 0.062”
Solder Mask:
LPI Solder mask, SMOBC on Top and Bottom Layers
Plating:
Open copper solder finish
Silkscreen:
On Top and Bottom Layers
IRAUDAMP5 PCB layers
Class D, Daughter-board:
Figure 40. PCB Layout – Top-Side Solder-Mask and Silkscreen
Summary of Contents for IRAUDAMP5
Page 45: ...www irf com Pa Figure 39 PCB Layout Motherboard ge 44 of 50 IRAUDAMP5 REV 3 1 Top Layer ...
Page 46: ...www irf com Top silk screen Page 45 of 50 IRAUDAMP5 REV 3 1 ...
Page 47: ...www irf com Page 46 of 50 IRAUDAMP5 REV 3 1 Bottom ...
Page 48: ...www irf com Page 47 of 50 IRAUDAMP5 REV 3 1 4 0 ...
Page 49: ...www irf com Page 48 of 50 IRAUDAMP5 REV 3 1 Bottom Silkscreen 4 0 ...