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IU_MAP_MANUAL_01i01_ENG 

 

3 /20 

1.

 

Introduction................................................................................................................................. 4

 

1.1.

 

Symbols ....................................................................................................................................... 4

 

2.

 

General Information .................................................................................................................... 5

 

2.1.

 

Designated use ............................................................................................................................ 5

 

2.2.

 

Features ....................................................................................................................................... 6

 

2.3.

 

Front panel .................................................................................................................................. 7

 

2.4.

 

Signal diodes ................................................................................................................................ 7

 

3.

 

Operation manual ....................................................................................................................... 8

 

3.1.

 

Operation description ................................................................................................................. 8

 

3.2.

 

Application examples .................................................................................................................. 9

 

3.2.1.

 

Circuit-breaker bay ...................................................................................................................... 9

 

3.2.2.

 

Arc protection with additional criteria ...................................................................................... 10

 

3.2.3.

 

Cascade connection ................................................................................................................... 10

 

3.3.

 

Diagnostic .................................................................................................................................. 11

 

3.3.1.

 

DOC – Device Operation Check ................................................................................................. 11

 

4.

 

Functional tests ......................................................................................................................... 12

 

4.1.

 

EC directives and harmonized standards .................................................................................. 12

 

4.2.

 

Electromagnetic compatibility .................................................................................................. 12

 

4.2.1.

 

Immunity ................................................................................................................................... 12

 

4.3.

 

Product safety requirements .................................................................................................... 14

 

4.4.

 

Climatic environmental tests..................................................................................................... 14

 

4.5.

 

Mechanical tests........................................................................................................................ 14

 

4.6.

 

Degree of protection ................................................................................................................. 14

 

4.7.

 

Installation requirements .......................................................................................................... 14

 

5.

 

Technical parameters ................................................................................................................ 15

 

5.1.

 

Input circuits .............................................................................................................................. 15

 

5.1.1.

 

Arc detection optic inputs ......................................................................................................... 15

 

5.1.2.

 

Binary inputs ............................................................................................................................. 15

 

5.2.

 

Output circuits ........................................................................................................................... 15

 

5.2.1.

 

Fiber outputs ............................................................................................................................. 15

 

5.2.2.

 

Binary outputs ........................................................................................................................... 16

 

5.3.

 

Power supply ............................................................................................................................. 16

 

5.4.

 

Connectors ................................................................................................................................ 16

 

5.5.

 

Mass and dimensions ................................................................................................................ 16

 

5.6.

 

Time parameters ....................................................................................................................... 16

 

6.

 

Description of connection sockets ............................................................................................ 17

 

7.

 

Connection diagram .................................................................................................................. 17

 

8.

 

Case sizes ................................................................................................................................... 18

 

9.

 

Remarks of manufacturer ......................................................................................................... 19

 

9.1.

 

Maintenance, inspections, repairs ............................................................................................ 19

 

9.2.

 

Storage and transport ............................................................................................................... 19

 

9.3.

 

Place of installation ................................................................................................................... 19

 

9.4.

 

Disposal ..................................................................................................................................... 19

 

9.5.

 

Guarantee.................................................................................................................................. 19

 

10.

 

Order specification .................................................................................................................... 20

 

11.

 

Contact ...................................................................................................................................... 20

 

 

 

 

Summary of Contents for Energetyka Map 6

Page 1: ...Arc Fault Protection User manual and technical documentation Document version 01i01 Update 2016 04 01...

Page 2: ...malfunction of protected object and result in threat to life and health Reliable and defect free operation of the device needs appropriate transportation handling storage installation and commissioni...

Page 3: ...unity 12 4 3 Product safety requirements 14 4 4 Climatic environmental tests 14 4 5 Mechanical tests 14 4 6 Degree of protection 14 4 7 Installation requirements 14 5 Technical parameters 15 5 1 Input...

Page 4: ...ontrol of operation of cascade connected devices SC Self check monitoring of internal states of the device DOC Device Operation Check allows you to check the correct operation of the device without re...

Page 5: ...can operate with the a bay control device it also can operate autonomously Device can directly open break ers circuits in the bays by the relay semiconductor outputs high rated power States of opera...

Page 6: ...ions unconditional including the blocking from digital inputs Diagnostic SC Selfcheck memory program and data User interface 4 signal diodes multifunction key Other functions Relay semiconductor outpu...

Page 7: ...and power on off Device Operation Check mechanism DOC 2 4 Signal diodes The diodes on the front panel are supposed to signal the most important states of device operation that re sult inter alia from...

Page 8: ...summed using three input system of auxiliary logical sum and this sum is given to binary output DO_2 Signals of binary input block optical signals and this state is signalling by LOCK diode Protection...

Page 9: ...off an arc current One of the optical inputs can be also used to connect the MAP 6 device placed in another bay where opening of the circuit breaker does not cut off an arc current Fig 3 2 1 1 Connect...

Page 10: ...on times can give a totally negligible time delay of the transmission of information about activation even a distant optical sensor This is a competitive solution compared to systems based on connecti...

Page 11: ...Check and correctness of fiber optic connections Holding the button for 5 seconds starts the DOC mechanism Switching to operation check mode is confirmed by a LED TEST Square wave a 1 Hz frequency is...

Page 12: ...Immunity Tab 4 2 1 1 Input and output ports including measuring ports Environmental phenom ena Test specification Description Basic standard Acceptance criteria Conducted disturbance induced by radio...

Page 13: ...ental pheno mena Test specification Description Basic standard Acceptance criteria Conducted disturbance induced by radio frequency fields Frequency sweep PN EN 61000 4 6 A 0 15 80 MHz Frequency range...

Page 14: ...1 Climatic environmental test Test Standard Description Cold tests PN EN 60068 2 1 2009 Minimum operational temperature 20 C 16 hours Minimum storage temperature 55 C 16 hours Dry heat tests PN EN 60...

Page 15: ...nsumption after excitation 5 mA Nominal voltage DC 110V Minimum excitation voltage DC 90 V Maximu de excitation voltage DC 50 V Current consumption before excitation 4 mA Current consumption after exc...

Page 16: ...ance load DC 24 V 8 A DC 250 V 0 1 A 25 W AC 380 V 8 A 2000 VA Switching rate at maximum contact load maks 10 min Contacts material AgCdO 5 3 Power supply Nominal voltage 18 36 V DC Power consumption...

Page 17: ...1 Digital input DI_1 2 Digital input DI_1 3 Digital input DI_2 4 Digital input DI_2 5 Relay output DO_2 6 Relay output DO_2 7 Relay semiconductor output DO_1 high rated power 8 Relay semiconductor ou...

Page 18: ...18 20 IU_MAP_MANUAL_01i01_ENG 8 Case sizes Fig 8 1 Case sizes...

Page 19: ...m rail 9 4 Disposal Products are made mostly from recyclable materials or materials that can be processed again or disposed of in environmentally sound manner Decommissioned devices can be collected f...

Page 20: ...24 V DC 1 110 V DC 2 220 V DC 3 230 V AC 4 Order example MAP 6 A2 B4 24 V DC power source and 230 V AC two state input voltages 11 Contact Tele and Radio Research Institute ICT and Electronics Centre...

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