ENGLISH
6
SOLDERING PROCEDURE
1 After desoldering the component, any solder
left on the printed circuit should be removed
with our
DR 5650
desoldering iron ref. 5650000.
4 Apply
FL 9582
flux ref. 0046565 in pads and
leads.
5 Solder the remaining pins. For this we
recommend to use our soldering irons of the
JBC series, which are available in two different
models:
2210 handpiece
ref. 2210000 for great
precision tasks, like SMD solders, etc.
2245 handpiece
ref. 2245000 for general
soldering tasks in professional electronics.
These soldering irons have a wide range of
cartridges with different models of tips. The
2 2 4 5 - 0 0 9 c a r t r i d g e a n d 2 2 4 5 - 0 1 0 a r e
specially designed for soldering SMD circuits
of the QFP and PLCC types.
Solder wire with a diameter of between 0.5 and
0.7 mm should be used.
2 Place the component or printed circuit with
the
MP 2260
Pick & Place ref. 2260000.
3 When the component is correctly placed,
solder its pins.In the case of integrated circuits
of the Flat Pack type, first solder one pin of
every IC angle to fix it in place in the circuits.
6 Depending on the nature of the component to
be soldered, use soldering paste together
with our
TE 5400
hot air station, which gives
very accurate air-flow regulation, between 4
and 12 l/min.
Summary of Contents for AM 6800
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