10
3.
Visually inspect for bent contacts (Recommend at least 1stpass visual inspection)
NO
TE
:
Refer to the Handling and Inspection Module for 1stand 2ndpass inspection details.
NO
TE
:
Glove images are for illustrative purposes only. Please consult local safety guidelines for
specific requirements
NOTE
:
Recommend not to hold the load plate as a lever, instead hold at tab with left hand, removing
the PnP cap with right hand
775-land LGA Package Insertion
1.
Lift processor package from shipping media by
grasping the substrate edges ONLY.
Note:
Orient processor package such that the Pin 1
triangle mark is on bottom left and both key
notches are on left side
2.
Land Side Cover Handling: Remove land side cover
with the opposite hand by depressing larger
retention tab and peeling the cover away
3.
Set and reserve the land side cover aside.
Note:
Always keep the land side cover on the
processor when not in the socket.
4.
Visually inspect the package gold pads: Scan the
processor package gold pad array for presence of
foreign material. Refer to Overview Module for FM
cleaning recommendations
5.
Orient the package with IHS up. Locate Pin 1 and
the two orientation key notches
6.
Carefully place the package into the socket body
using a purely vertical motion
CAUTION:
Using Vacuum Pen for installation is
not
recommended
7.
Verify that package is within the socket body and
properly mated to the orient keys
8.
Close the socket by
i.
Rotating the Load Plate onto the package HIS
ii.
While pressing down lightly on Load Plate, engage
the Load Lever.
iii.
Securing Load Lever with Load Plate tab under
retention tab of Load Lever
Press to remove
Pin 1 Indicator
Alignment Key
