11
775-Land Package Removal
1.
Open the Load Plate/Lever with both hands:
With left hand index finger and thumb to support the
load plate edge, engage PnP cap with right hand
thumb and peel the cap from LGA775 Socket while
pressing on center of PnP cap to assist in removal.
2.
Pick up 775-land LGA package:
By Vacuum Pen: Place a minimum 9-mm cup at
approximately the center of IHS.
Recommend not to place Vacuum Pen on IHS edge.
Risk of dropping and causing bent contact.
Recommend not to use Vacuum Pen for inserting
CPU By Hand: Index finger to hold load plate hinge
side and thumb to hold load lever side
3.
Lift the package straight up and away.
4.
Assemble processors land side cover immediately
to prevent contamination.
i.
While holding the processor by the 3 corners, the
other hand lift land side cover from work surface
by grasping at the large retention tabs. Ensure
retention tabs and package are pointing each
other.
ii.
Orientate so that land side cover chamfer is
matching with package Pin 1 location.
iii.
Hook the first large retention tab on the package
substrate. Then press the opposite tab onto the
substrate.
iv.
Place processor with land side cover installed onto
proper shipping media or other ESD approved work
surface
Chamfer on Land Side
Cover (align this with
pin 1 mark on 775-land
LGA package)
Large Retention Tabs
(pointing towards user)
Hold at corners
