ii
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED,
TRANSMITTED OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT
WRITTEN PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE 917PBAG/917PBA/917GBAG/917GBA
MOTHER-BOARD AND WE DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE,
CORRECT ANY TIME WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT
WARRANTY OF ANY KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR
CONSEQUENTIAL DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS
OF USE OF DATA, INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion
Revision History
Date
3.0
Third Edition
March 2005
Item Checklist
5
917PBAG/917PBA/917GBAG/917GBA Motherboard
5
Cable for IDE/Floppy
5
CD for motherboard utilities
□
Cable for USB Port 3/4 (Option)
5
SPDIF-IN/SPDIF-OUT Adaptor
5
Cable for Serial ATA IDE Port
5
917PBAG/917PBA/917GBAG/917GBA User’s Manual
Intel Pentium 4 Processor Family
Cooling Solutions
As processor technology pushes to faster speeds and higher performance, thermal management
becomes increasingly crucial when building computer systems. Maintaining the proper thermal
environment is key to reliable, long-term system operation. The overall goal in providing the
proper thermal environment is keeping the processor below its specified maximum case
temperature. Heatsinks induce improved processor heat dissipation through increased surface area
and concentrated airflow from attached fans. In addition, interface materials allow effective
transfers of heat from the processor to the heatsink. For optimum heat transfer, Intel recommends
the use of thermal grease and mounting clips to attach the heatsink to the processor.
When selecting a thermal solution for your system, please refer to the website below for
collection of heatsinks evaluated and recommended by Intel for use with Intel processors. Note,
those heatsinks are recommended for maintaining the specified Maximum T case requirement. In
addition, this collection is not intended to be a comprehensive listing of all heatsinks that support
Intel processors.
For vendor list of heatsink and fan, please visit :
http://developer.intel.com/design/Pentium4/components/index
