2-9
R27
R29
R16
HS1
R31
R30
L5
D9
L7
R26
R14
CN3
R25
D18
C26
R28
R13
U6
D17
V7
V5
V3
V4
C18
C1
V2
C2
D3
D4
C19
C17
C31
PVCC
PVCC
PGND
PGND
GND
GND
C3
C4
D2
D1
V1
R9
F1
T2.5AH250V
R32
L1
HS2
T1
D14
JP9
F2
R15
R22
CN2
CN5
C25
C27
C16
C15
C13
C12
C20
CN4
C14
C21
CN1
R10
R23
C1
1
JP8
D10
GND3
GND2
L4
L3
L6
D19
D12
GND 5V
GND 5V
D16
D1
1
D13
FL+
FL+
-25V
ECO
5VE
GND
GND
GND
5VD
5VD
12V
R2
R1
C6
D6
C5
C23
C10
C9
C7
C8
C22
C24
C28
L2
U2
U3
R8
R4
R24
R3
R6
R5
R7
R19
R12
R11
D8
JP5
JP3
JP4
JP1
JP2
JP6
SW1
D5
JP7
R18
R20
R21
N
L
PGND
PVCC
D15
R17
R35
C32
C30
C29
R34
FL+
FL-
5VE
-25V
12V
DGND
D5V
AGND
EC0
HOT_GND
U1
R33
VD1
D7
Printed circuit boards
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
<SMPS board (forward side)>
(Lead free solder used in the board (material : Sn-Ag-Cu, melting point : 219 Centigrade))
<SMPS board (reverse side)>
Summary of Contents for CA-UXG375
Page 25: ...3 13 MEMO ...
Page 66: ... M E M O ...