Model 4200A-SCS Parameter Analyzer Reference Manual
Appendix L: Wafer-level reliability testing
4200A-901-01 Rev. C / February 2017
L-7
Electromigration project
The Electromigration project (
em-const-i
) is shown in the figure below.
Figure 834: em-const-i project tree
The subsite (
em
) is configured for subsite cycling using current stressing on a single device (
metal-
line
). This project includes actions to control the temperature of the chuck. The subsite will not start
cycling until the chuck reaches the specified temperature. After the first pre-stress cycle to perform a
characterization test on the device, subsequent cycles current stress the device for a specified time
before repeating the test. After the subsite completes, the
cooldown
action cools the chuck.
The Stress Properties setup window for the
em-const-i
project is shown in the following figure.
Figure 835: Stress Properties pane: em-const-i project
