Limit Testing
11-13
Multiple-element device binning
Figure 11-8 shows a basic binning system to test three-element resistor networks. Note that
this system requires a scanner card that is installed in a switching mainframe. Scanner card
switching is controlled through the Trigger Link. End binning control is required for this test
system, therefore, the grading mode must be used.
Trigger operations for the scanner and SourceMeter must be con
fi
gured appropriately for
this test. In general, the scanner must be con
fi
gured to scan three channels, and the Source-
Meter must be con
fi
gured to perform a 3-point sweep and output a trigger to the scanner after
each measurement. See Section 10 for details.
When the testing process is started, Ch 1 of the scanner card closes, and R1 is measured.
Two events occur concurrently after the measurement is completed: R1 is tested, and the
SourceMeter sends a trigger pulse to the switching mainframe causing Ch 1 to open and Ch 2
to close. Assuming there is no failure, a measurement is then performed on R2. While R2 is
being tested, Ch 2 opens and Ch 3 closes. Again assuming no failure, a measurement is per-
formed on R3 and it is then tested. Assuming that all the tests on all three resistors passed, the
device package is placed in the pass bin.
If any of the resistors in the network fails a test, the FAIL message is displayed, and the dig-
ital output information for the
fi
rst failure is stored in memory (assuming that END binning
control is selected). After the sweep is completed, the SourceMeter sends the output pattern
stored in memory. This is the output pattern for the
fi
rst test failure. The component handler
places the DUT package into the bin assigned to that particular failure.
The handler selects the next resistor network, and the testing process is repeated.
Switching Mainframe
Handler
Trigger
Link
Scanner Card
Ch 1
Ch 2
Ch 3
Dig
In
Multi-Element
Device Package
R1
R2
R3
In/Out
HI
LO
Trigger
Link *
Dig
I/O
6430
* Trigger layer configured to output trigger pulse after each measurement.
Figure 11-8
Binning system -
multiple element
devices
Summary of Contents for 6430
Page 26: ......
Page 32: ......
Page 78: ...2 14 Connections ...
Page 98: ...3 20 Basic Source Measure Operation ...
Page 138: ...5 30 Source Measure Concepts ...
Page 156: ...6 18 Range Digits Speed and Filters ...
Page 168: ...7 12 Relative and Math ...
Page 176: ...8 8 Data Store ...
Page 202: ...9 26 Sweep Operation ...
Page 248: ...11 22 Limit Testing ...
Page 310: ...16 6 SCPI Signal Oriented Measurement Commands ...
Page 418: ...17 108 SCPI Command Reference ...
Page 450: ...18 32 Performance Verification ...
Page 477: ...A Specifications ...
Page 489: ...B StatusandErrorMessages ...
Page 498: ...B 10 Status and Error Messages ...
Page 499: ...C DataFlow ...
Page 503: ...D IEEE 488BusOverview ...
Page 518: ...D 16 IEEE 488 Bus Overview ...
Page 519: ...E IEEE 488andSCPI ConformanceInformation ...
Page 523: ...F MeasurementConsiderations ...
Page 539: ...G GPIB488 1Protocol ...
Page 557: ......