Kirisun FP520, Service Manual

FP520 Service Manual 

Page 33 of 64 

2CC1-16-C0G500-6R0C 

Chip multilayer capacitance 

1608,6P±0.25P ,50V,C0G 

1 

C608 

2CC1-16-C0G500-6R0D 

Chip multilayer capacitance 

1608,6P±0.5P,50V,C0G 

1 

C609 

2CC1-16-X7R500-471K 

Chip multilayer capacitance 

1608,470P±10%,50V,X7R 

1 

C611 

2CC1-20-Y5V160-106Z 

chip multilayer capacitance 

2012,10uF+80%/-20%,16V,Y5V 

24 

C8, C9, C11, C15, C16, C17, C18, C63, C103, C106, C109, C116, C119, C319, C344, C348, C642, C750, C752, C802, 

C806, C815, C817, C49 

2CT1-TS32-160-1R0M 

chip tantalum capacitance 

3216,1μF±20%,16V,TS series (A level) 

1 

C359 

2CT1-TS32-350-R10M 

chip tantalum capacitance 

3216,0.1μF±20%,35V, TS series (A level) 

1 

C358 

2CT1-TS32-6R3-150M 

chip tantalum capacitance 

3216,15μF±20%,6.3V,TS TS series (A level) 

2 

C1, C376 

2CT1-TS35-6R3-101M 

chip tantalum capacitance 

C-TAN,100uF,20%,SIZE-B,6.3V 

1 

C805 

2LH1-R401R5-R03-05 

chip air core inductance 

wire diameter φ0.40,inner diameter φ1.5,3 circles, pin height 0.5mm, 

clockwise circling 

8 

L600, L601, L603, L709, L710, L711, L713, L714 

2LH1-R401R5-R04-05 

chip air core inductance 

wire diameter φ0.40, inner diameter φ1.5,4 circles, pin height 

0.5mm,clockwise circling 

2 

L602, L605 

2LH1-R401R5-R08-05 

chip air core inductance 

wire diameter φ0.40, inner diameter φ1.5,8 circles, high pin 

1 

L607 

2LH1-R501R5-L05-05 

chip air core inductance 

wire diameter φ0.50, inner diameter φ1.5,5 circles, high pin 

1 

L606 

2LL1-16-12NJ 

laminated inductance 

1608,12nH±5%(MLG1608B12NJ/LL1608-FH12N) 

1 

L611 

2LL1-16-1R0K 

laminated inductance 

1608,1μH±10%(MLF1608A1R0K) 

1 

L703 

2LL1-16-22NJ 

laminated inductance 

1608,22nH±5%(MLG1608B22NJ) 

1 

L311 

2LL1-16-27NJ 

laminated inductance 

1608,27nH±5%(MLG1608B27NJ) 

1 

L609 

2LL1-16-33NJ 

laminated inductance 

1608,33nH±5%(MLG1608B33NJ) 

1 

L313 

2LL1-16-3N9S 

laminated inductance 

1608,3.9nH±0.3nH(MLG1608B3N9S) 

1 

L604 

2LL1-16-3R3K 

laminated inductance 

1608,3.3μH±10%(MLF1608A3R3K TA00) 

2 

L309, L323 

2LL1-16-82NJ 

laminated inductance 

1608,82nH±5%(MLG1608B82NJ) 

2 

L307, L310 

2LL1-16-R22J 

laminated inductance 

1608,0.22μH±5%(LG HK 1608R22J-T/MLG1608B220N) 

4 

L306, L319, L324,,L303 

2LL1-16-R56K 

laminated inductance 

1608,560nH±10%(MLF1608DR56K) 

1 

L300 

2LW1-16UC-180J 

chip wire wound inductance 

1608,18nH±5%,ceramic core (C1608CB-18NJ) 

3 

L301, L700, L304 

2LW1-16UC-181J 

chip wind wound inductance 

1608,180nH±5%, ceramic core (C1608CB-R18J) 

1 

L321 

2LW1-16UC-680J 

chip wind wound inductance 

1608,68nH±5%, ceramic core (C1608CB-68NJ) 

2 

L701, L706 

2LW1-20UC-221J 

chip wind wound inductance 

2012,220nH±5%, ceramic core (LQN21AR22J/LQW2BHNR22J03L) 

1 

L608 

2LW1-25UC-103J 

chip wind wound inductance 

2520,10μH±5%, ceramic core (FLM2520-100J) 

1 

L305 

2LW1-25UC-331K 

chip wind wound inductance 

2520,330nH±10%, ceramic core (FLM2520-R33K/SGWI2520HR33J) 

1 

L704 

2LW1-25UC-561K 

chip wind wound inductance 

2520,560nH±10%, ceramic core    (FLM2520-R56K) 

1 

L705 

2LW1-32UC-170J 

chip wind wound inductance 

3216,17nH±5%,air cored wire (LQN1A23NJ04/LQW31HN17NJ03L) 

1 

L322 

2LW1-32UC-270J 

chip wind wound inductance 

3216,27nH±5%, air cored wire (LQN1A27NJ04/LQW31HN27NJ01L) 

1 

L308 

2RE1-10-22R0 

chip precision resistance   

1005

,22Ω±1% 

1 

R804 

2RE1-16-1503 

chip precision resistance 

1608,150K±1% 

7 

R617, R618, R619, R624, R625, R627, R628 

2RS1-10-000O 

chip resistance 

1005,0Ω 

22 

R45, C2, C3, R13, R206, R41, R14, R19, R1, R16, R17, R18, R39, R40, R107, R143, R604, R616, R824, C73, C74, R51 

2RS1-10-100J 

chip resistance 

1005,10Ω±5% 

5 

R231, R244, R300, R308, R324 

2RS1-10-101J 

chip resistance 

1005,100Ω±5% 

3 

R321, R703, R248 

2RS1-10-102J 

chip resistance 

1005,1K±5% 

23 

R813, R823, R15, R38, R106, R197, R198, R229, R236, R237, R238, R239, R254, R255, R301, R304, R341, R602, 

R606, R719, R53, R50, R57