Kirisun FP520, Service Manual

FP520 Service Manual 

Page 38 of 64 

2CC1-16-C0G500-180J 

Chip multilayer capacitance 

1608,18P±5%,50V,C0G 

1 

C515 

2CC1-16-C0G500-270J 

Chip multilayer capacitance 

1608,27P±5%,50V,C0G 

1 

C65 

2CC1-16-C0G500-330J 

Chip multilayer capacitance 

1608,33P±5%,50V,C0G 

1 

C326 

2CC1-16-C0G500-5R0C 

Chip multilayer capacitance 

1608,5P±0.25P,50V,C0G 

1 

C365 

2CC1-16-C0G500-680J 

Chip multilayer capacitance 

1608,68P±5%,50V,C0G 

2 

C66, C634 

2CC1-16-C0G500-7R0D 

Chip multilayer capacitance 

1608,7P±0.5P,50V,C0G 

1 

C505 

2CC1-16-X7R500-102K 

Chip multilayer capacitance 

1608,1000P±10%,50V,X7R 

1 

C611 

2CC1-20-Y5V100-334Z 

Chip multilayer capacitance 

2012,330nF+80%/-20%,10V,Y5V 

1 

C705 

2CC1-20-Y5V160-106Z 

Chip multilayer capacitance 

2012,10uF+80%/-20%,16V,Y5V 

24 

C8, C9, C11, C15, C16, C17, C18, C63, C103, C106, C109, C116, C119, C319, C344, C348, C642, C750, C752, 

C802, C806, C815, C817, C68 

2CT1-TS32-160-3R3M 

chip tantalum capacitance 

3216,3.3μF±20%,16V,TS series (A level) 

1 

C359 

2CT1-TS32-350-R10M 

Chip tantalum capacitance 

3216,0.1μF±20%,35V,TS series (A level) 

1 

C360 

2CT1-TS32-350-R33M 

Chip tantalum capacitance 

3216,0.33μF±20%,35V,TS series (A level) 

1 

C358 

2CT1-TS32-6R3-150M 

Chip tantalum capacitance 

3216,15μF±20%,6.3V,TS series (A level) 

2 

C1, C376 

2CT1-TS35-100-470M 

Chip tantalum capacitance 

3528,47μF±20%,10V,TS series (B level) 

1 

C805 

2LH1-R301R5-L05-05 

chip air core inductance 

wire diameter φ0.30 inner diameter φ1.5 5 circle rewind, high pin 

1 

L11 

2LH1-R301R0-L07-05 

chip air core inductance 

wire diameter φ0.30, inner diameter φ1.0,7circle rewind, high pin 

1 

L501 

2LH1-R301R5-R07-05 

chip air core inductance 

wire diameter φ0.30 inner diameter φ1.5 7 circle, wind, high pin 

3 

L505, L502, L503 

2LH1-R401R5-R03-05 

chip air core inductance 

wire diameterφ0.40, inner diameter φ1.5,3circle, pin height 0.5mm,wind 

2 

L9, L500 

2LH1-R401R5-L08-05 

chip air core inductance 

wire diameter φ0.40,inner diameter φ1.5,8 circle, reverse, high pin 

1 

L607 

2LL1-16-1R0K 

laminated inductance 

1608,1μH±10%(MLF1608A1R0K) 

1 

L703 

2LL1-16-22NJ 

Laminated inductance 

1608,22nH±5%(MLG1608B22NJ) 

1 

L610 

2LL1-16-33NJ 

Laminated inductance 

1608,33nH±5%(MLG1608B33NJ) 

2 

L700, L301 

2LL1-16-39NJ 

Laminated inductance 

1608,39nH±5%(MLG1608B39NJ) 

1 

L311 

2LL1-16-3R3K 

Laminated inductance 

1608,3.3μH±10%(MLF1608A3R3K TA00) 

2 

L309, L323 

2LL1-16-82NJ 

Laminated inductance 

1608,82nH±5%(MLG1608B82NJ) 

2 

L313, L609 

2LL1-16-R10J 

Laminated inductance 

1608,0.1uH±5%(MLG1608BR10J\MLG1608B100NJ/HK1608R10J-T) 

2 

L611, L307 

2LL1-16-68NJ 

Laminated inductance 

1608,68nH±5%(MLG1608B68NJ) 

1 

L701 

2LL1-16-R18J 

Laminated inductance 

1608,0.18μH±5%(LG HK 1608R18J-T/MLG1608B180N) 

2 

L321, L324 

2LL1-16-R22J 

Laminated inductance 

1608,0.22μH±5%(LG HK 1608R22J-T/MLG1608B220N) 

4 

L306, L310, L319, L303 

2LL1-16-R56K 

Laminated inductance 

1608,560nH±10%(MLF1608DR56K) 

1 

L300 

2LW1-16UC-180J 

chip wire wound inductance 

1608,18nH±5%,ceramic core (C1608CB-18NJ) 

1 

L304 

2LW1-20UC-220G 

chip wire wound inductance 

2012,22nH±2%, ceramic core (C2012CB-22NG) 

1 

L308 

2LW1-20UC-221J 

chip wire wound inductance 

2012,220nH±5%, ceramic core (LQN21AR22J/LQW2BHNR22J03L) 

1 

L608 

2LW1-20UC-390GA 

chip wire wound inductance 

2012,39nH±2%, ceramic core (C2012C-39NG) 

1 

L322 

2LW1-20UC-470J 

chip wire wound inductance 

2012,47nH±5%, ceramic core (C2012C-47NJ) 

1 

L714 

2LW1-20UC-680J 

chip wire wound inductance 

2012,68nH±5%, ceramic core (C2012C-68NJ) 

1 

L2 

2LW1-20UC-560JA 

chip wire wound inductance 

2012,56nH±5%, ceramic core (C2012C-56NJ) 

3 

L706, L709, L713 

2LW1-25UC-102JA 

chip wire wound inductance 

2520,1μH±5%, ceramic core (FHW1008UC1R0J) 

1 

L606 

2LW1-25UC-103J 

chip wire wound inductance 

2520,10μH±5%, ceramic core (FLM2520-100J) 

1 

L305 

2LW1-25UC-331K 

chip wire wound inductance 

2520,330nH±10%, ceramic core (FLM2520-R33K/SGWI2520HR33J) 

1 

L704