COMe-bSL6 – User Guide Rev. 1.4
www.kontron.com
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Table of Contents
Symbols ................................................................................................................................................................................................................. 6
Table of Contents............................................................................................................................................................................................... 9
List of Tables ...................................................................................................................................................................................................... 11
List of Figures ..................................................................................................................................................................................................... 11
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Introduction ......................................................................................................................................................................................... 13
1.1. Product Description................................................................................................................................................................................... 13
1.2. Product Naming Clarification ................................................................................................................................................................ 13
1.3. COM Express® Documentation ............................................................................................................................................................. 13
1.4. COM Express® Functionality ................................................................................................................................................................. 14
1.5. COM Express® Benefits ........................................................................................................................................................................... 14
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Product Specification ....................................................................................................................................................................... 15
2.1. Module Variants ........................................................................................................................................................................................ 15
2.1.1. Commercial Temperature Grade Modules (0°C to +60°C) ........................................................................................................ 15
2.1.2. Extended Temperature Grade Modules (E1,-25°C to +75°C) ................................................................................................... 15
2.1.3. Industrial Temperature Grade Modules (E2S, -40°C to +85°C) .............................................................................................. 16
2.2. Accessories ................................................................................................................................................................................................. 17
2.3. Functional Specification ......................................................................................................................................................................... 19
2.3.1. Block Diagram COMe-bSL6 ................................................................................................................................................................. 19
2.3.2. Processor ................................................................................................................................................................................................ 20
2.3.3. Chipset ..................................................................................................................................................................................................... 23
2.3.4. System Memory ................................................................................................................................................................................... 23
2.3.5. Graphics ................................................................................................................................................................................................... 24
2.3.6. LVDS.......................................................................................................................................................................................................... 24
2.3.7. Audio ......................................................................................................................................................................................................... 25
2.3.8. PCI Express (PCIE) Configuration .................................................................................................................................................... 25
2.3.9. USB ............................................................................................................................................................................................................ 27
2.3.10. SATA........................................................................................................................................................................................................ 27
2.3.11. Ethernet .................................................................................................................................................................................................. 28
2.3.12. COMe High Speed Interfaces .......................................................................................................................................................... 29
2.3.13. Storage Features ................................................................................................................................................................................ 29
2.3.14. BIOS/Software Features.................................................................................................................................................................. 29
2.3.15. COMe Features .................................................................................................................................................................................... 30
2.3.16. Kontron Features................................................................................................................................................................................ 30
2.4. Electrical Specification ........................................................................................................................................................................... 31
2.4.1. Power Supply Voltage .......................................................................................................................................................................... 31
2.4.2. Power Supply Rise Time ..................................................................................................................................................................... 31
2.4.3. Power Supply Voltage Ripple ............................................................................................................................................................ 31
2.4.4. Power Consumption ............................................................................................................................................................................ 31
2.4.6. Power Supply Control Settings ....................................................................................................................................................... 32
2.4.7. Power Supply Modes .......................................................................................................................................................................... 33
2.5. Thermal Management ........................................................................................................................................................................... 34
2.5.1. Heatspreader and Cooling Solutions .............................................................................................................................................. 34
2.5.2. Operating with Kontron Heatspreader Plate (HSP) Assembly ............................................................................................. 34
2.5.3. Operating without Kontron Heatspreader Plate Assembly ................................................................................................... 34
2.5.4. On-board Fan Connector ................................................................................................................................................................... 35
2.6. Environmental Specification................................................................................................................................................................ 36
2.6.1. Temperature........................................................................................................................................................................................... 36
