Introduction
EBC2
Page 1 - 4
© 2005 Kontron Modular Computers GmbH
ID 29022, Rev. 01
26873
.02.VC.050120/135417
P R E L I M I N A R Y
E²Brain™ modules are plugged into customized backplanes or standardized carrier boards
which themselves provide the physical interfaces (PHYs) and connectors, power, and addition-
al IO controllers. Through the use of E²Brain™ modules the system developer is relieved of the
task of designing computers, and, instead, they permit him to concentrate on the specific prod-
uct development.
E²Brain™ is a computer platform dedicated not just to one architecture like the PC and Win-
dows architecture, but it is open for all architectures including PowerPC, ARM, SH, x86, and
others. E²Brain™ modules are very suitable for “deeply” embedded applications requiring flex-
ible computing power combined with versatile and high-performance communications power.
Although typical E²Brain™ modules are designed to be low power consumption devices, they
are part of a well thought out thermal design concept which considers the thermal aspects right
from the beginning. Where higher power consumption is unavoidable, E²Brain™ modules are
fitted with appropriate BrainCAP™s. By utilizing BrainCAP™s, cooling, mechanical stabiliza-
tion, and EMI protection are combined in a single concept to satisfy almost any application re-
quirement.
1.1.2
Basic Architecture
The following figure illustrates the basic functional architecture of E²Brain™ modules. Common
to all E²Brain™ modules are the data processing and communications core and the system and
communications interfaces.
The application requirements determine the functionality required of the E²Brain™ module core
which in turn mandates the functionality to be provided by the system and communications in-
terfaces. Both of these interfaces are comprised of a base set and an extended set of functional
features.
The system interface to the application is accomplished through connectors Pn1 and Pn2. Con-
nector Pn1 provides the base set of system interfacing and Pn2 the extended set. If the appli-
cation does not require extended system interfacing, it is not necessary to populate connector
Pn2. The same analogy applies to the communications interfacing whereby connector Pn3 pro-
vides the base set of communications interfacing and Pn4 the extended set. Pn4 is not required
to be populated if there is not an application requirement for it. This concept together with a
corresponding core provides a maximum of scalability and flexibility to satisfy the most de-
manding of applications.
1.1.3
E²Brain™ System Environment
The E²Brain™ module form factor and mechanical and electrical interfacing are so conceived
as to allow the use of E²Brain™ modules in practically any kind of system environment. These
mezzanine modules can easily be integrated on most standardized carrier boards (VME, Com-
pactPCI, PC PCI, etc.) as well as any other conceivable type of carrier board capable of pro-
viding the required mechanical and electrical infrastructure.
In addition to this infrastructure, thermal energy dissipation requirements must be taken into
consideration when implementing applications using E²Brain™ modules. The E²Brain™ con-
cept basically calls for modules to provide their own thermal energy dissipation. It may, howev-
er, be necessary to add additional thermal energy dissipation capability depending on the
overall system environment. To satisfy such requirements, E²Brain™ modules may be
equipped with specially designed cooling devices that are adapted to the specific system envi-
ronment.
