6 | Function description
Editing the soldering profile in the [Profile management] tab and changing it permanently
The parameters in the [Information] tabulator
The following parameters may be edited here in the [Information]:
In the [
Profile settings
]:
– [Name]: This is defined by default when selecting the profile template. If you
The soldering templates are always identified as “basic”.
“LF” means “lead free”.
“SnPB” means tin-lead.
“linear” indicates a uniform heating-up phase.
“bended once” indicates a heating-up curve with one bend.
“bended twice” indicates a heating-up curve with two bends.
“soak zone” indicates a heating phase with reduced heat from T1 to T2, for the
activation of the flux material.
– [Board]: This is defined by default when selecting the profile template (
).
The templates are named “Low and medium mass” for low to medium PCB
mass, “Medium mass” for medium PCB mass and “Hight mass” for high PCB
mass, while “Universal” is suitable for all types of PCB. If you want, you may re-
name the PCBs.
– [Component]: This is defined by default when selecting the profile template
(
). The templates are named “Low and medium mass” for low to medium
component mass, “Medium and high mass” for medium to high component
mass and “Sensitive and high mass” in case of high-mass or sensitive compon-
ents. If you want, you may rename the components.
– [Control sensor]: Selection of the temperature sensor that controls the solder-
ing process based on its temperature measurements. IRS [IRS] (Infrared
sensor), [TC1] (Thermocouple 1) or [TC2]. The currently measured temperature
of the selected sensor is displayed in area (2). The IRS is not suitable for shiny
or reflecting surfaces, nor in case of very small boards.
– [Adaptor (head)]: adapter used (cooling baffle). No function; used only for sav-
ing information.
– [Heating head position]: Determine soldering distance from the PCB, from 30
mm to 70 mm.
– [Heating head position]: Heating head type [L-head] (large) or [S-head] (small).
– [Lens]: Objective used. No function; used only for saving information.
– [pipette]: Pipette used. No function; used only for saving information.
In the [
Placement
] area:
– [Dip mode]: You may choose among three soldering methods:
– [No automation]: Normal soldering, without flux material dip and without
using a component coated with flux. The component is picked from the
component tray, aligned and put in soldering position.
– [Auto. Dip]: The dip template prepared with flux material must be placed
on a component tray. The component is lifted from the other component
tray and dipped in the flux material of the dip template, aligned and put in
soldering position.
– [Auto. Print]: The print template prepared with the component coated
with flux must be placed on a component tray. The component is picked
from the print template, aligned and put in soldering position.
Ersa GmbH
Operating instructions HR 550 XL EN 3BA00247-01 | Rev. 1
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