7 | Tutorial – Soldering or desoldering a component
Task 3 “Deposit”
7.9 Task 3 “Deposit”
If you want to solder a new component at the desoldering point, clean it of any re-
sidual solder:
CAUTION
Risk of burning due to heated machine parts and PCB!
All heated machine parts as well as the surrounding housing parts and product sup-
port frame, the circuit board and the components become hot even during warm-up
to the process temperature [Tinit]!
Parts are particularly hot during the soldering process! After the soldering process,
wait until the device and the PCB have cooled down and reached non-hazardous tem-
peratures!
a) Distribute a small amount of viscous, non-volatile flux material on the residual
solder points.
b) Remove any residual solder with a suitable tool,
ð
e.g. with the Scavenger residual solder sucker available for your Rework
system. The Rework system can be reconditioned with it.
Fig. 30:
Available as optional: Scavenger residual solder sucker
ð
e.g. with the following solder tips: PowerWell 0102WDLF23/SB (small),
0102ADLF40/SB (medium) or 0102ZDLF150/SB (large)
c) Remove flux residue with Ersa Flux Remover (0FR200).
d) Dry the solder joints with a clean, lint-free cloth.
e) Place and properly align the soldered component on the component tray.
Ersa GmbH
Operating instructions HR 550 XL EN 3BA00247-01 | Rev. 1
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