BT85x Series
Datasheet
Embedded Wireless Solutions Support Center:
http://ews-support.lairdtech.com
www.lairdtech.com/bluetooth
33
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17
O
RDERING
I
NFORMATION
Part Number
Description
BT850-SA
BTv4.2 Dual Mode USB HCI Module – Integrated Antenna
BT851
BTv4.2 Dual Mode USB Dongle
BT850-ST
BTv4.2 Dual Mode USB HCI Module –External Antenna
DVK-BT850-SA
Development Kit for BT850-SA Module
DVK-BT850-ST
Development Kit for BT850-ST Module
17.1.
General Comments
This is a preliminary datasheet. Please check with Laird for the latest information before commencing a design. If
in doubt, ask.
18
B
LUETOOTH
SIG
A
PPROVALS
18.1.
Application Note: Subsystem Combinations
This application note covers the procedure for generating a new Declaration ID for a Subsystem combination on
the Bluetooth SIG website. In the instance of subsystems, a member can combine two or more subsystems to
create a complete Bluetooth End Product solution.
Subsystem listings referenced as an example:
Design Name
Owner
Declaration
ID
Link to listing on the SIG website
BT850-SA
Laird
D037603
https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=37603
Windows 8
(Host
Subsystem)
Microsoft
Corporation
B012854
https://www.bluetooth.org/tpg/QLI_viewQDL.cfm?qid=12854
Laird Customer Declaration ID Procedure
This procedure assumes that the member is simply combining two subsystems to create a new design, without
any modification to the existing, qualified subsystems. This is achieved by using the Listing interface on the
Bluetooth SIG website.
Error! Reference source not found.
shows the basic subsystem combination of a
controller and host subsystem. The Controller provides the RF/BB/LM and HCI layers, with the Host providing
L2CAP, SDP, GAP, RFCOMM/SPP and any other specific protocols and profiles existing in the Host subsystem
listing. The design may also include a Profile Subsystem.
The controller provides the RF/BB/LM and HCI layers, with the Host providing L2CAP, SDP, GAP, RFCOMM/SPP
and any other specific protocols and profiles existing in the Host subsystem listing. The design may also include a
Profile Subsystem.