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Copyright © 2010 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
3. TECHNICAL BRIEF
ʹΠΡΪΣΚΘΙΥ͑ι ͣͨ͑͡͡ͽ͑ͶΝΖΔΥΣΠΟΚΔΤ͑͟ͺΟΔ͑͑͟ͲΝΝ͑ΣΚΘΙΥ͑ΣΖΤΖΣΧΖΕ͑͟
ΟΝΪ͑ΗΠΣ͑ΥΣΒΚΟΚΟΘ͑ΒΟΕ͑ΤΖΣΧΚΔΖ͑ΡΦΣΡΠΤΖΤ
ͽͶ͑ͺΟΥΖΣΟΒΝ͑ΆΤΖ͑ΟΝΪ
Y^VX[W
Table 3.3.1 Band SW Logic Table
Figure 3.3.2 TX-module CIRCUIT DIAGRAM
3. TECHNICAL BRIEF
Both PA blocks share common power supply pads to distribute current. The output of each PA
block and the outputs to the four receive pads are connected to the antenna pad through a
PHEMT RF switch. The GaAs die, PHEMT die, Silicon (Si) die and passive components are mounted
on a multi-layer laminate substrate. The assembly is encapsulated with plastic overmold.
1.
˂
= DON’T CARE
Both PA blocks share common power supply pads to distribute current. The output of each PA block and
the outputs to the four receive pads are connected to the antenna pad through a PHEMT RF switch. The
GaAs die, PHEMT die, Silicon (Si) die and passive components are mounted on a multi-layer laminate
substrate. The assembly is encapsulated with plastic overmold.
C336
220p
C324
6p
C334
6p
C327
10K
R319
18K
R301
33p
C345
DNI
C325
1K
R302
33p
C346
DNI
C316
C326
10u
VRF
33p
C329
22p
C332
SKY77547
U303
34
35
36
16
15
14
13
12
11
10
31
32
33
71
9
81
8
91
7
02
6
12
5
22
4
32
3
42
2
25
26
27
28
29
30
1
GND1
VBATT
DCS_PCS_IN
GND17
GSM_IN
GND16
GND15
CI
G
OL
V
41
D
N
G
P
M
A
R
V
31
D
N
G
N
E_
XT
21
D
N
G
1
S
B
11
D
N
G
2
S
B
01
D
N
G
2
D
N
G
9
D
N
G
3
D
N
G
8
D
N
G
4
D
N
G
T
N
A
PGND3
PGND2
PGND1
GND5
RX1
RX2
RX3
RX4
GND6
GND7
PGND6
PGND5
PGND4
VBAT
22p
C333
BAND_SW2
PA_EN
BAND_SW1
APC
GSM_OUT
DCS_PCS_OUT
DNI
DCS
PCS
GSM850
EGSM