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ESD PRECAUTIONS
Electrostatically Sensitive Devices (ESD)
Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.
1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off
any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.
2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive sur-
face such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.
4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can
generate electrical charges sufficient to damage ESD devices.
5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD
devices.
6. Do not remove a replacement ESD device from its protective package until immediately before you are
ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive materials).
7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the
protective material to the chassis or circuit assembly into which the device will by installed.
CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL
OTHER SAFETY PRECAUTIONS.
8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion
such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gen-
erate static electricity sufficient to damage an ESD device).
CAUTION. GRAPHIC SYMBOLS
THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE, IS
INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED “DAN-
GEROUS VOLTAGE” THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE A RISK OF
ELECTRIC SHOCK.
THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERT THE
SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION IN SERVICE
LITERATURE.
Summary of Contents for LH-SW5100
Page 5: ... 1 5 SPECIFICATIONS ...
Page 6: ... 1 6 LOCATION OF CUSTOMER CONTROLS FRONT PANEL DISPLAY WINDOW ...
Page 7: ... 1 7 REAR PANEL ...
Page 8: ... 1 8 REMOTE CONTROL ...
Page 10: ... 2 2 2 AUDIO µ COM CIRCUIT ...
Page 12: ... 2 4 4 FRONT CIRCUIT 2 2 ...
Page 14: ... 3 2 2 Test debug flow ...
Page 15: ... 3 3 ...
Page 16: ... 3 4 ...
Page 17: ... 3 5 ...
Page 18: ... 3 6 ...
Page 19: ... 3 7 ...
Page 23: ... 3 11 2 Tray close waveform 3 Tray open waveform ...
Page 25: ... 3 13 6 LASER POWER CONTROL RELATED SIGNAL NO DISC CONDITION 7 DISC TYPE JUDGEMENT W VEFORM ...
Page 26: ... 3 14 ...
Page 27: ... 3 15 8 FOCUS ON W VEFORM ...
Page 28: ... 3 16 9 SPINDLE CONTROL W VEFORM NO DISC CONDITION ...
Page 29: ... 3 17 10 TRACKING CONTROL RELATED SIGNAL System checking ...
Page 30: ... 3 18 11 RF W VEFORM 12 MT1379 AUDIO OPTICAL AND COAXIAL OUTPUT ASPDIF ...
Page 31: ... 3 19 13 MT1379 VIDEO OUTPUT W VEFORM 1 Full colorbar signal CVBS 2 Y ...
Page 32: ... 3 20 3 C 14 AUDIO OUTPUT FORM AUDIO DAC 1 Audio related Signal ...
Page 33: ... 6 1 SECTION 6 SPEAKER PART ELECTRICAL TROUBLESHOOTING GUIDE ...
Page 34: ... 6 2 ...
Page 35: ... 6 3 ...
Page 36: ... 6 4 ...
Page 37: ... 6 5 ...
Page 38: ... 6 6 MEMO ...
Page 39: ... BLOCK DIAGRAM 2 5 2 6 ...
Page 40: ...2 7 2 8 SCHEMATIC DIAGRAMS FRONT POWER SCHEMATIC DIAGRAM ...
Page 41: ...2 9 2 10 MICOM SCHEMATIC DIAGRAM ...
Page 42: ...2 11 2 12 I O SCHEMATIC DIAGRAM ...
Page 43: ...2 13 2 14 DAP SCHEMATIC DIAGRAM ...
Page 44: ...2 15 2 16 AMP SCHEMATIC DIAGRAM ...
Page 45: ...2 17 2 18 SMPS SCHEMATIC DIAGRAM ...
Page 46: ...2 19 2 20 WIRING DIAGRAM ...
Page 47: ...2 21 2 22 VOLTAGE SHEET IC TR ...
Page 48: ...2 23 2 24 ...
Page 49: ...2 25 2 26 PRINTED CIRCUIT DIAGRAMS MAIN P C BOARD SOLDER SIDE ...
Page 50: ...2 27 2 28 MAIN P C BOARD COMPONENT SIDE ...
Page 51: ...2 29 2 30 FRONT P C BOARD ...
Page 52: ...2 31 2 32 SMPS P C BOARD ...
Page 53: ...3 21 3 22 DVD PART SCHEMATIC DIAGRAMS MPEG SCHEMATIC DIAGRAM ...
Page 54: ...3 23 3 24 SERVO SCHEMATIC DIAGRAM ...
Page 55: ...3 25 3 26 INTERFACE SCHEMATIC DIAGRAM ...
Page 56: ...3 27 3 28 VOLTAGE SHEET IC TR ...
Page 57: ...3 29 3 30 PRINTED CIRCUIT DIAGRAM DVD P C BOARD SOLDER SIDE ...
Page 58: ...3 31 3 32 DVD P C BOARD COMPONENT SIDE ...
Page 61: ...6 7 6 8 BLOCK DIAGRAM ...
Page 62: ...6 9 6 10 SHEMATIC DIAGRAMS SCHEMATIC DIAGRAM ACC W5100 ...
Page 63: ...6 11 6 12 SCHEMATIC DIAGRAM FA W5100 ...
Page 64: ...6 13 6 14 SMPS SCHEMATIC DIAGRAM FA W5100 ...
Page 65: ...6 15 6 16 WIRING DIAGRAM ...
Page 66: ...6 17 6 18 PRINTED CIRCUIT DIAGRAM ACC W5100 P C BOARD ...
Page 67: ...6 19 6 20 FA W5100SL SR MAIN P C BOARD ...
