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Document 36 II Stormaster Version 1.02 © Copyright 2008 LPI
Ground Resistance Lowering Compounds
• Ground resistance lowering compounds (such as LPI RESLO and GRIP) are supplied when
the existing soil mass has a high resistivity.
• Using the compounds can lower earth resistance/impedance.
• Compounds will require water and a mixing container.
• Follow all installation and safety instructions as supplied with products when applying
the compounds.
Bonding The Lightning Earth
Where separate earths exist eg. Structure, Power, Communications and Lightning Protection,
they need to be bonded to form an equipotential ground plane. This will stop ground loops
and potential differences arising under transient conditions.
Before bonding of these earths takes place, make sure proper authorisation is gained.
Bonding cable must be 70mm
2
(2/0 AWG) minimum depending on local standards. It may
be necessary to use a Transient Earth Clamp (TEC 100) which bonds all earths to the same
potential under transient conditions.
For further information, it is advisable that local applicable standards are used, ie. IEC 61024-
1, BS 6551, AS1768-2007, NFPA 780, C22.1-98 and NEC.
Labelling
It is the responsibility of the customer/installer to label earth pits or earthing systems to
local requirements.
Installation of the HVSC Downconductor
If installing LPI HVSC, the HVSC downconductors(s) may have had the upper terminations
completed at a pre-specified end of the cable by the LPI factory before being shipped.
When removing HVSC downconductor packaging, do not use a knife or cut in any way as this
can damage the outer layer of termination.
LPI’s HVSC has an outer layer which is approximately 2mm (1/16in.) thick. Be careful not to
damage this layer.
Summary of Contents for Stormaster 15
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